Experimental and theoretical analysis of integrated circuit (IC) chips on flexible substrates subjected to bending

Ying Chen, Jianghong Yuan, Yingchao Zhang, Yonggang Huang*, Xue Feng

*Corresponding author for this work

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Abstract

The interfacial failure of integrated circuit (IC) chips integrated on flexible substrates under bending deformation has been studied theoretically and experimentally. A compressive buckling test is used to impose the bending deformation onto the interface between the IC chip and the flexible substrate quantitatively, after which the failed interface is investigated using scanning electron microscopy. A theoretical model is established based on the beam theory and a bi-layer interface model, from which an analytical expression of the critical curvature in relation to the interfacial failure is obtained. The relationships between the critical curvature, the material, and the geometric parameters of the device are discussed in detail, providing guidance for future optimization flexible circuits based on IC chips.

Original languageEnglish (US)
Article number135310
JournalJournal of Applied Physics
Volume122
Issue number13
DOIs
StatePublished - Oct 7 2017

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ASJC Scopus subject areas

  • Physics and Astronomy(all)

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