Explicit analytical solutions for elastic fields in two imperfectly bonded half-spaces with a thermal inclusion

Donglong Li, Zhanjiang Wang, Q Jane Wang

Research output: Contribution to journalArticle

Abstract

The paper generalizes the analytical solutions for the thermal-eigenstrain-induced elastic field in two joined half-space solids or a bimaterial with an interface of coupled dislocation-like and force-like imperfects. The present model permits quantitative jumps in displacements and/or stresses from one medium to the other. The model also leads to a set of explicit closed-form expressions for the dilatation-induced elastic fields in half-spaces I and II joined by such an imperfect interface. Cases for the elastic fields subjected to an ellipsoidal, a spherical, a spherical shell, and a cylindrical thermal inclusion are analyzed, and key results are validated by comparison with existing experimental results. The influences of several types of interfaces, such as the perfectly bonded, dislocation-like, and force-like interfaces, on the stress and displacement transmissions are further discussed.

LanguageEnglish (US)
Pages1-16
Number of pages16
JournalInternational Journal of Engineering Science
Volume135
DOIs
StatePublished - Feb 1 2019

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Keywords

  • Coupled imperfect interfaces
  • Joined half-spaces
  • Jumping coefficients
  • Thermal eigenstrain

ASJC Scopus subject areas

  • Materials Science(all)
  • Engineering(all)
  • Mechanics of Materials
  • Mechanical Engineering

Cite this

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abstract = "The paper generalizes the analytical solutions for the thermal-eigenstrain-induced elastic field in two joined half-space solids or a bimaterial with an interface of coupled dislocation-like and force-like imperfects. The present model permits quantitative jumps in displacements and/or stresses from one medium to the other. The model also leads to a set of explicit closed-form expressions for the dilatation-induced elastic fields in half-spaces I and II joined by such an imperfect interface. Cases for the elastic fields subjected to an ellipsoidal, a spherical, a spherical shell, and a cylindrical thermal inclusion are analyzed, and key results are validated by comparison with existing experimental results. The influences of several types of interfaces, such as the perfectly bonded, dislocation-like, and force-like interfaces, on the stress and displacement transmissions are further discussed.",
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Explicit analytical solutions for elastic fields in two imperfectly bonded half-spaces with a thermal inclusion. / Li, Donglong; Wang, Zhanjiang; Wang, Q Jane.

In: International Journal of Engineering Science, Vol. 135, 01.02.2019, p. 1-16.

Research output: Contribution to journalArticle

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AU - Wang, Q Jane

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AB - The paper generalizes the analytical solutions for the thermal-eigenstrain-induced elastic field in two joined half-space solids or a bimaterial with an interface of coupled dislocation-like and force-like imperfects. The present model permits quantitative jumps in displacements and/or stresses from one medium to the other. The model also leads to a set of explicit closed-form expressions for the dilatation-induced elastic fields in half-spaces I and II joined by such an imperfect interface. Cases for the elastic fields subjected to an ellipsoidal, a spherical, a spherical shell, and a cylindrical thermal inclusion are analyzed, and key results are validated by comparison with existing experimental results. The influences of several types of interfaces, such as the perfectly bonded, dislocation-like, and force-like interfaces, on the stress and displacement transmissions are further discussed.

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