Explicit analytical solutions for elastic fields in two imperfectly bonded half-spaces with a thermal inclusion

Donglong Li, Zhanjiang Wang*, Qian Wang

*Corresponding author for this work

Research output: Contribution to journalArticlepeer-review

9 Scopus citations

Abstract

The paper generalizes the analytical solutions for the thermal-eigenstrain-induced elastic field in two joined half-space solids or a bimaterial with an interface of coupled dislocation-like and force-like imperfects. The present model permits quantitative jumps in displacements and/or stresses from one medium to the other. The model also leads to a set of explicit closed-form expressions for the dilatation-induced elastic fields in half-spaces I and II joined by such an imperfect interface. Cases for the elastic fields subjected to an ellipsoidal, a spherical, a spherical shell, and a cylindrical thermal inclusion are analyzed, and key results are validated by comparison with existing experimental results. The influences of several types of interfaces, such as the perfectly bonded, dislocation-like, and force-like interfaces, on the stress and displacement transmissions are further discussed.

Original languageEnglish (US)
Pages (from-to)1-16
Number of pages16
JournalInternational Journal of Engineering Science
Volume135
DOIs
StatePublished - Feb 2019

Funding

D. Li and Z. Wang would like to express gratitude to the support from the National Science Foundation of China under 51775457 , the fellowship support from China Scholar Council and the research fund from State Key Laboratory of Mechanical Transmission at Chongqing University, Chongqing, China, under 0301002109162. Q. Wang would like to acknowledge the support from US National Science Foundation under CMMI-1434834.

Keywords

  • Coupled imperfect interfaces
  • Joined half-spaces
  • Jumping coefficients
  • Thermal eigenstrain

ASJC Scopus subject areas

  • General Materials Science
  • Mechanics of Materials
  • General Engineering
  • Mechanical Engineering

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