Explicit analytical solutions for elastic fields in two imperfectly bonded half-spaces with a thermal inclusion

Donglong Li, Zhanjiang Wang*, Qian Wang

*Corresponding author for this work

Research output: Contribution to journalArticlepeer-review

5 Scopus citations

Abstract

The paper generalizes the analytical solutions for the thermal-eigenstrain-induced elastic field in two joined half-space solids or a bimaterial with an interface of coupled dislocation-like and force-like imperfects. The present model permits quantitative jumps in displacements and/or stresses from one medium to the other. The model also leads to a set of explicit closed-form expressions for the dilatation-induced elastic fields in half-spaces I and II joined by such an imperfect interface. Cases for the elastic fields subjected to an ellipsoidal, a spherical, a spherical shell, and a cylindrical thermal inclusion are analyzed, and key results are validated by comparison with existing experimental results. The influences of several types of interfaces, such as the perfectly bonded, dislocation-like, and force-like interfaces, on the stress and displacement transmissions are further discussed.

Original languageEnglish (US)
Pages (from-to)1-16
Number of pages16
JournalInternational Journal of Engineering Science
Volume135
DOIs
StatePublished - Feb 2019

Keywords

  • Coupled imperfect interfaces
  • Joined half-spaces
  • Jumping coefficients
  • Thermal eigenstrain

ASJC Scopus subject areas

  • Materials Science(all)
  • Engineering(all)
  • Mechanics of Materials
  • Mechanical Engineering

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