@inproceedings{68063ada56b440e1b8246836dc9e144c,
title = "Fabrication of high-efficiency heterogeneous Si/III-V integration with short optical vertical interconnect access",
abstract = "Silicon nanophotonic platform based on a silicon-on-insulator substrate enables dense photonic integration due to transparency for light propagation and ultra-high refractive index contrast for light confinement. Here, we integrate silicon together with III-V for high-efficiency heterogeneous Silicon/III-V and short vertical optical interconnect access. The fabrication involves 3 critical processes: 1) obtaining more than 80\% maximum bonded areas of Si with III-V, 2) precise alignment of III-V nano-devices on top of the passive devices and 3) vertical sidewall etch profile of Si and III-V devices. The measurement results show around 90\% coupling efficiency. The realization of this heterogeneous Si/III-V integration platform will open up enormous opportunities for photonic system on silicon through integrating various devices.",
keywords = "III-V, Optical waveguides, Photonics integration, Propagation losses",
author = "Ng, \{Doris K.T.\} and Jing Pu and Qian Wang and Lim, \{Kim Peng\} and Yongqiang Wei and Yadong Wang and Yicheng Lai and Ho, \{Seng Tiong\}",
year = "2013",
doi = "10.1117/12.2002786",
language = "English (US)",
isbn = "9780819493972",
series = "Proceedings of SPIE - The International Society for Optical Engineering",
booktitle = "Optoelectronic Integrated Circuits XV",
note = "Optoelectronic Integrated Circuits XV ; Conference date: 06-02-2013 Through 07-02-2013",
}