Fabrication of microstructured silicon (μs-Si) from a bulk Si wafer and its use in the printing of high-performance thin-film transistors on plastic substrates

Keon Jae Lee, Heejoon Ahn, Michael J. Motala, Ralph G. Nuzzo, Etienne Menard, John A. Rogers

Research output: Contribution to journalArticlepeer-review

14 Scopus citations

Abstract

In this paper, we report a new fabrication route to generate microstructured, single-crystalline silicon (μs-Si) ribbons using (1 1 0) silicon. Two different methods were explored for producing these printable structures. This work also introduces a second-process innovation in the fabrication of microstructured semiconductor objects for printed large-area circuits, namely the direct integration of a high-quality, thermally grown silicon dioxide (SiO2) layer for use as a gate dielectric in top-gate metal-oxide-silicon field effect transistors. We also demonstrate and characterize a soft, conformable lamination process that considerably enhances the mechanical stability of devices printed on plastic, allowing bending radii as small as 0.8 cm. These structures enable a reduction of the bending strains localized at the device interface. These improvements were fully characterized by finite element simulations of the strain distribution present in a descriptive model of the multilayer laminated circuit.

Original languageEnglish (US)
Article number075018
JournalJournal of Micromechanics and Microengineering
Volume20
Issue number7
DOIs
StatePublished - Jun 30 2010

ASJC Scopus subject areas

  • Mechanical Engineering
  • Electrical and Electronic Engineering
  • Mechanics of Materials
  • Electronic, Optical and Magnetic Materials

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