Abstract
Experimental evidence is presented that very early in the fatigue lifetime of Sn-Pb eutectic solder the fatigue damage is governed by microcrack nucleation. A model for thermally assisted fatigue crack initiation is presented using standard equations for nucleation in phase transformations. Predictions of the model are in good agreement with nucleation data for this solder.
Original language | English (US) |
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Pages (from-to) | 5-9 |
Number of pages | 5 |
Journal | Materials Science & Engineering A: Structural Materials: Properties, Microstructure and Processing |
Volume | 272 |
Issue number | 1 |
DOIs | |
State | Published - Nov 15 1999 |
Externally published | Yes |
Keywords
- Activation
- Crack
- Fatigue
- Nucleation
- Solder
- Thermal
ASJC Scopus subject areas
- General Materials Science
- Condensed Matter Physics
- Mechanics of Materials
- Mechanical Engineering