Flexure-based microscope objective

Christopher R. Stockbridge; Fatih H. Köklü; Euan Ramsay; Yang Lu; M. Selim Ünlü; Bennett B. Goldberg; Thomas G. Bifano

Flexure-based microscope objective

Christopher R. Stockbridge, Fatih H. Köklü, Euan Ramsay, Yang Lu, M. Selim Ünlü, Bennett B. Goldberg, Thomas G. Bifano

Physics and Astronomy

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Abstract

Continuous reduction of feature dimensions in modern computer chips increases the challenge of measuring them. The state-of-the-art technology for imaging and fault isolation in integrated circuits (ICs) is done from the backside and uses a solid immersion lens (SIL) that sits directly on the back of the substrate to be imaged. A SIL can drastically increase the Numerical Aperture (NA) of the system and values of 3.5 are possible in silicon ICs. The physical placement of the lens requires high precision and good optical contact with no more than a 5nm gap under any portion of the lens. Commercial failure analysis systems require integration of the SIL with an objective system. This paper discusses the design of an integrated objective for imaging with an aplanatic SIL (aSIL).

Original language	English (US)
Title of host publication	Proceedings - ASPE 2012 Summer Topical Meeting
Subtitle of host publication	Precision Engineering and Mechatronics Supporting the Semiconductor Industry
Pages	105-108
Number of pages	4
Volume	53
State	Published - Dec 1 2012
Event	ASPE 2012 Summer Topical Meeting on Precision Engineering and Mechatronics Suporting the Semiconductor Industry - Berkeley, CA, United States Duration: Jun 24 2012 → Jun 26 2012

Other

Other	ASPE 2012 Summer Topical Meeting on Precision Engineering and Mechatronics Suporting the Semiconductor Industry
Country/Territory	United States
City	Berkeley, CA
Period	6/24/12 → 6/26/12

ASJC Scopus subject areas

Engineering (miscellaneous)

Cite this

@inproceedings{f2c0505ac1a34146b7dd857590487fa6,

title = "Flexure-based microscope objective",

abstract = "Continuous reduction of feature dimensions in modern computer chips increases the challenge of measuring them. The state-of-the-art technology for imaging and fault isolation in integrated circuits (ICs) is done from the backside and uses a solid immersion lens (SIL) that sits directly on the back of the substrate to be imaged. A SIL can drastically increase the Numerical Aperture (NA) of the system and values of 3.5 are possible in silicon ICs. The physical placement of the lens requires high precision and good optical contact with no more than a 5nm gap under any portion of the lens. Commercial failure analysis systems require integration of the SIL with an objective system. This paper discusses the design of an integrated objective for imaging with an aplanatic SIL (aSIL).",

author = "Stockbridge, {Christopher R.} and K{\"o}kl{\"u}, {Fatih H.} and Euan Ramsay and Yang Lu and {\"U}nl{\"u}, {M. Selim} and Goldberg, {Bennett B.} and Bifano, {Thomas G.}",

year = "2012",

month = dec,

day = "1",

language = "English (US)",

isbn = "9781887706605",

volume = "53",

pages = "105--108",

booktitle = "Proceedings - ASPE 2012 Summer Topical Meeting",

note = "ASPE 2012 Summer Topical Meeting on Precision Engineering and Mechatronics Suporting the Semiconductor Industry ; Conference date: 24-06-2012 Through 26-06-2012",

}

Stockbridge, CR, Köklü, FH, Ramsay, E, Lu, Y, Ünlü, MS, Goldberg, BB & Bifano, TG 2012, Flexure-based microscope objective. in Proceedings - ASPE 2012 Summer Topical Meeting: Precision Engineering and Mechatronics Supporting the Semiconductor Industry. vol. 53, pp. 105-108, ASPE 2012 Summer Topical Meeting on Precision Engineering and Mechatronics Suporting the Semiconductor Industry, Berkeley, CA, United States, 6/24/12.

TY - GEN

T1 - Flexure-based microscope objective

AU - Stockbridge, Christopher R.

AU - Köklü, Fatih H.

AU - Ramsay, Euan

AU - Lu, Yang

AU - Ünlü, M. Selim

AU - Goldberg, Bennett B.

AU - Bifano, Thomas G.

PY - 2012/12/1

Y1 - 2012/12/1

N2 - Continuous reduction of feature dimensions in modern computer chips increases the challenge of measuring them. The state-of-the-art technology for imaging and fault isolation in integrated circuits (ICs) is done from the backside and uses a solid immersion lens (SIL) that sits directly on the back of the substrate to be imaged. A SIL can drastically increase the Numerical Aperture (NA) of the system and values of 3.5 are possible in silicon ICs. The physical placement of the lens requires high precision and good optical contact with no more than a 5nm gap under any portion of the lens. Commercial failure analysis systems require integration of the SIL with an objective system. This paper discusses the design of an integrated objective for imaging with an aplanatic SIL (aSIL).

AB - Continuous reduction of feature dimensions in modern computer chips increases the challenge of measuring them. The state-of-the-art technology for imaging and fault isolation in integrated circuits (ICs) is done from the backside and uses a solid immersion lens (SIL) that sits directly on the back of the substrate to be imaged. A SIL can drastically increase the Numerical Aperture (NA) of the system and values of 3.5 are possible in silicon ICs. The physical placement of the lens requires high precision and good optical contact with no more than a 5nm gap under any portion of the lens. Commercial failure analysis systems require integration of the SIL with an objective system. This paper discusses the design of an integrated objective for imaging with an aplanatic SIL (aSIL).

UR - http://www.scopus.com/inward/record.url?scp=84884302891&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=84884302891&partnerID=8YFLogxK

M3 - Conference contribution

AN - SCOPUS:84884302891

SN - 9781887706605

VL - 53

SP - 105

EP - 108

BT - Proceedings - ASPE 2012 Summer Topical Meeting

T2 - ASPE 2012 Summer Topical Meeting on Precision Engineering and Mechatronics Suporting the Semiconductor Industry

Y2 - 24 June 2012 through 26 June 2012

ER -

Flexure-based microscope objective

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ASJC Scopus subject areas

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