Flexure-based microscope objective

Christopher R. Stockbridge, Fatih H. Köklü, Euan Ramsay, Yang Lu, M. Selim Ünlü, Bennett B. Goldberg, Thomas G. Bifano

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

Continuous reduction of feature dimensions in modern computer chips increases the challenge of measuring them. The state-of-the-art technology for imaging and fault isolation in integrated circuits (ICs) is done from the backside and uses a solid immersion lens (SIL) that sits directly on the back of the substrate to be imaged. A SIL can drastically increase the Numerical Aperture (NA) of the system and values of 3.5 are possible in silicon ICs. The physical placement of the lens requires high precision and good optical contact with no more than a 5nm gap under any portion of the lens. Commercial failure analysis systems require integration of the SIL with an objective system. This paper discusses the design of an integrated objective for imaging with an aplanatic SIL (aSIL).

Original languageEnglish (US)
Title of host publicationProceedings - ASPE 2012 Summer Topical Meeting
Subtitle of host publicationPrecision Engineering and Mechatronics Supporting the Semiconductor Industry
Pages105-108
Number of pages4
Volume53
StatePublished - Dec 1 2012
EventASPE 2012 Summer Topical Meeting on Precision Engineering and Mechatronics Suporting the Semiconductor Industry - Berkeley, CA, United States
Duration: Jun 24 2012Jun 26 2012

Other

OtherASPE 2012 Summer Topical Meeting on Precision Engineering and Mechatronics Suporting the Semiconductor Industry
CountryUnited States
CityBerkeley, CA
Period6/24/126/26/12

ASJC Scopus subject areas

  • Engineering (miscellaneous)

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