Fluidic shear-stress measurement using surface-micromachined sensors

Jin Biao Huang*, Chang Liu, Fukang Jiang, Steve Tung, Yu Chong Tai, Chih Ming Ho

*Corresponding author for this work

Research output: Chapter in Book/Report/Conference proceedingConference contribution

10 Scopus citations

Abstract

A poly-silicon hot-film shear-stress sensor insulated by a vacuum-chamber underneath has been designed and fabricated by the surface micromachining technology. The sensor is operated at both constant current and constant temperature modes. The dynamic performance (including time constant and cut-off frequency) measurement, calibration, and temperature compensation of the sensor have been realized.

Original languageEnglish (US)
Title of host publicationAsia-Pacific Microelectronics 2000
PublisherIEEE
Pages16-19
Number of pages4
StatePublished - Dec 1 1995
EventProceedings of the 1995 IEEE Region 10 International Conference on Microelectronics and VLSI, TENCON'95 - Hong Kong, Hong Kong
Duration: Nov 6 1995Nov 10 1995

Other

OtherProceedings of the 1995 IEEE Region 10 International Conference on Microelectronics and VLSI, TENCON'95
CityHong Kong, Hong Kong
Period11/6/9511/10/95

ASJC Scopus subject areas

  • Computer Science Applications
  • Electrical and Electronic Engineering

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