The collision between a copper dimer and an Ar film is investigated by molecular-dynamics simulations. A dimer fragmentation rate of 24% is found for an impact kinetic energy of 25 eV per atom, in agreement with previous experimental results. Temporary dissociation of the dimer followed by a reaggregation is observed in 14% of the cases. The collision induces a fast superheating of the Ar film around the impact point followed by a liquefaction. The cooling rate of the copper dimer is found to be one order lower than the cooling rate of the Ar film in the impact area.
|Original language||English (US)|
|Number of pages||4|
|Journal||Physical Review B - Condensed Matter and Materials Physics|
|State||Published - Jan 1 1999|
ASJC Scopus subject areas
- Electronic, Optical and Magnetic Materials
- Condensed Matter Physics