Fragmentation and recombination of copper dimers deposited on an ar film

M. Ratner, W. Harbich, S. Fedrigo

Research output: Contribution to journalArticlepeer-review

17 Scopus citations


The collision between a copper dimer and an Ar film is investigated by molecular-dynamics simulations. A dimer fragmentation rate of 24% is found for an impact kinetic energy of 25 eV per atom, in agreement with previous experimental results. Temporary dissociation of the dimer followed by a reaggregation is observed in 14% of the cases. The collision induces a fast superheating of the Ar film around the impact point followed by a liquefaction. The cooling rate of the copper dimer is found to be one order lower than the cooling rate of the Ar film in the impact area.

Original languageEnglish (US)
Pages (from-to)11730-11733
Number of pages4
JournalPhysical Review B - Condensed Matter and Materials Physics
Issue number16
StatePublished - 1999

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Condensed Matter Physics


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