High-angle grain-boundary junctions in YBa2Cu3O7: Normal-state resistance and 1/f noise

Li Liu; E. R. Nowak; H. M. Jaeger; B. V. Vuchic; K. L. Merkle; D. B. Buchholz; R P H Chang

doi:10.1103/PhysRevB.51.16164

High-angle grain-boundary junctions in YBa2Cu3O7: Normal-state resistance and 1/f noise

Li Liu^*, E. R. Nowak, H. M. Jaeger, B. V. Vuchic, K. L. Merkle, D. B. Buchholz, R P H Chang

^*Corresponding author for this work

Materials Science and Engineering

Research output: Contribution to journal › Article › peer-review

1 Scopus citations

Abstract

We have investigated the normal-state resistance and the excess low-frequency (1/f) noise in 45°tilt [001] grain-boundary junctions in YBa2Cu3O7 thin films. A characteristic temperature dependence of the resistance fluctuations and a linear temperature dependence of the grain-boundary resistance (with a negative temperature coefficient) emerge as common features. These observations are quantitatively compared with a model of many, parallel conduction paths across the boundary, taking into account both temperature-independent and thermally activated transport processes.

Original language	English (US)
Pages (from-to)	16164-16167
Number of pages	4
Journal	Physical Review B
Volume	51
Issue number	22
DOIs	https://doi.org/10.1103/PhysRevB.51.16164
State	Published - Jan 1 1995

ASJC Scopus subject areas

Condensed Matter Physics

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title = "High-angle grain-boundary junctions in YBa2Cu3O7: Normal-state resistance and 1/f noise",

abstract = "We have investigated the normal-state resistance and the excess low-frequency (1/f) noise in 45°tilt [001] grain-boundary junctions in YBa2Cu3O7 thin films. A characteristic temperature dependence of the resistance fluctuations and a linear temperature dependence of the grain-boundary resistance (with a negative temperature coefficient) emerge as common features. These observations are quantitatively compared with a model of many, parallel conduction paths across the boundary, taking into account both temperature-independent and thermally activated transport processes.",

author = "Li Liu and Nowak, {E. R.} and Jaeger, {H. M.} and Vuchic, {B. V.} and Merkle, {K. L.} and Buchholz, {D. B.} and Chang, {R P H}",

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doi = "10.1103/PhysRevB.51.16164",

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T1 - High-angle grain-boundary junctions in YBa2Cu3O7

T2 - Normal-state resistance and 1/f noise

AU - Liu, Li

AU - Nowak, E. R.

AU - Jaeger, H. M.

AU - Vuchic, B. V.

AU - Merkle, K. L.

AU - Buchholz, D. B.

AU - Chang, R P H

PY - 1995/1/1

Y1 - 1995/1/1

N2 - We have investigated the normal-state resistance and the excess low-frequency (1/f) noise in 45°tilt [001] grain-boundary junctions in YBa2Cu3O7 thin films. A characteristic temperature dependence of the resistance fluctuations and a linear temperature dependence of the grain-boundary resistance (with a negative temperature coefficient) emerge as common features. These observations are quantitatively compared with a model of many, parallel conduction paths across the boundary, taking into account both temperature-independent and thermally activated transport processes.

AB - We have investigated the normal-state resistance and the excess low-frequency (1/f) noise in 45°tilt [001] grain-boundary junctions in YBa2Cu3O7 thin films. A characteristic temperature dependence of the resistance fluctuations and a linear temperature dependence of the grain-boundary resistance (with a negative temperature coefficient) emerge as common features. These observations are quantitatively compared with a model of many, parallel conduction paths across the boundary, taking into account both temperature-independent and thermally activated transport processes.

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