High performance low cost package and platform design for 56G PAM4 SerDes

Qi Zhu; Hank Wu; Kusuma Matta; Oluwafemi Akinwale

doi:10.1109/EDAPS47854.2019.9011658

High performance low cost package and platform design for 56G PAM4 SerDes

Qi Zhu, Hank Wu, Kusuma Matta, Oluwafemi Akinwale

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

1 Scopus citations

Abstract

This paper will walk-through the process and challenges of design and integration of 56G PAM4 PHY into a low cost SoC package and platform targeting 5G base stations market. In order to deliver best in class design and meet strict electrical compliance from both the SerDes designer and the IEEE802.3 standards, an amalgamation of signal integrity optimization techniques are addressed in this paper.

Original language	English (US)
Title of host publication	EDAPS 2019 - Electrical Design of Advanced Packaging and Systems Symposium
Publisher	Institute of Electrical and Electronics Engineers Inc.
ISBN (Electronic)	9781728124322
DOIs	https://doi.org/10.1109/EDAPS47854.2019.9011658
State	Published - Dec 2019
Externally published	Yes
Event	2019 Electrical Design of Advanced Packaging and Systems Symposium, EDAPS 2019 - Kaohsiung, Taiwan, Province of China Duration: Dec 16 2019 → Dec 18 2019

Publication series

Name	IEEE Electrical Design of Advanced Packaging and Systems Symposium
Volume	2019-December
ISSN (Print)	2151-1225
ISSN (Electronic)	2151-1233

Conference

Conference	2019 Electrical Design of Advanced Packaging and Systems Symposium, EDAPS 2019
Country/Territory	Taiwan, Province of China
City	Kaohsiung
Period	12/16/19 → 12/18/19

Keywords

56G
Optimization
PAM4
Package
SerDes
Single Integrity

ASJC Scopus subject areas

Control and Systems Engineering
Electrical and Electronic Engineering
Automotive Engineering
Computer Science(all)

Access to Document

10.1109/EDAPS47854.2019.9011658

Cite this

Zhu, Q., Wu, H., Matta, K., & Akinwale, O. (2019). High performance low cost package and platform design for 56G PAM4 SerDes. In EDAPS 2019 - Electrical Design of Advanced Packaging and Systems Symposium Article 9011658 (IEEE Electrical Design of Advanced Packaging and Systems Symposium; Vol. 2019-December). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/EDAPS47854.2019.9011658

@inproceedings{86cad65179f443d58c2d7ab2ae662123,

title = "High performance low cost package and platform design for 56G PAM4 SerDes",

abstract = "This paper will walk-through the process and challenges of design and integration of 56G PAM4 PHY into a low cost SoC package and platform targeting 5G base stations market. In order to deliver best in class design and meet strict electrical compliance from both the SerDes designer and the IEEE802.3 standards, an amalgamation of signal integrity optimization techniques are addressed in this paper.",

keywords = "56G, Optimization, PAM4, Package, SerDes, Single Integrity",

author = "Qi Zhu and Hank Wu and Kusuma Matta and Oluwafemi Akinwale",

note = "Publisher Copyright: {\textcopyright} 2019 IEEE.; 2019 Electrical Design of Advanced Packaging and Systems Symposium, EDAPS 2019 ; Conference date: 16-12-2019 Through 18-12-2019",

year = "2019",

month = dec,

doi = "10.1109/EDAPS47854.2019.9011658",

language = "English (US)",

series = "IEEE Electrical Design of Advanced Packaging and Systems Symposium",

publisher = "Institute of Electrical and Electronics Engineers Inc.",

booktitle = "EDAPS 2019 - Electrical Design of Advanced Packaging and Systems Symposium",

address = "United States",

}

Zhu, Q, Wu, H, Matta, K & Akinwale, O 2019, High performance low cost package and platform design for 56G PAM4 SerDes. in EDAPS 2019 - Electrical Design of Advanced Packaging and Systems Symposium., 9011658, IEEE Electrical Design of Advanced Packaging and Systems Symposium, vol. 2019-December, Institute of Electrical and Electronics Engineers Inc., 2019 Electrical Design of Advanced Packaging and Systems Symposium, EDAPS 2019, Kaohsiung, Taiwan, Province of China, 12/16/19. https://doi.org/10.1109/EDAPS47854.2019.9011658

High performance low cost package and platform design for 56G PAM4 SerDes. / Zhu, Qi; Wu, Hank; Matta, Kusuma et al.
EDAPS 2019 - Electrical Design of Advanced Packaging and Systems Symposium. Institute of Electrical and Electronics Engineers Inc., 2019. 9011658 (IEEE Electrical Design of Advanced Packaging and Systems Symposium; Vol. 2019-December).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

TY - GEN

T1 - High performance low cost package and platform design for 56G PAM4 SerDes

AU - Zhu, Qi

AU - Wu, Hank

AU - Matta, Kusuma

AU - Akinwale, Oluwafemi

PY - 2019/12

Y1 - 2019/12

N2 - This paper will walk-through the process and challenges of design and integration of 56G PAM4 PHY into a low cost SoC package and platform targeting 5G base stations market. In order to deliver best in class design and meet strict electrical compliance from both the SerDes designer and the IEEE802.3 standards, an amalgamation of signal integrity optimization techniques are addressed in this paper.

AB - This paper will walk-through the process and challenges of design and integration of 56G PAM4 PHY into a low cost SoC package and platform targeting 5G base stations market. In order to deliver best in class design and meet strict electrical compliance from both the SerDes designer and the IEEE802.3 standards, an amalgamation of signal integrity optimization techniques are addressed in this paper.

KW - 56G

KW - Optimization

KW - PAM4

KW - Package

KW - SerDes

KW - Single Integrity

UR - http://www.scopus.com/inward/record.url?scp=85085016601&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=85085016601&partnerID=8YFLogxK

U2 - 10.1109/EDAPS47854.2019.9011658

DO - 10.1109/EDAPS47854.2019.9011658

M3 - Conference contribution

AN - SCOPUS:85085016601

T3 - IEEE Electrical Design of Advanced Packaging and Systems Symposium

BT - EDAPS 2019 - Electrical Design of Advanced Packaging and Systems Symposium

PB - Institute of Electrical and Electronics Engineers Inc.

T2 - 2019 Electrical Design of Advanced Packaging and Systems Symposium, EDAPS 2019

Y2 - 16 December 2019 through 18 December 2019

ER -

High performance low cost package and platform design for 56G PAM4 SerDes

Abstract

Publication series

Conference

Keywords

ASJC Scopus subject areas

Access to Document

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