High Resolution Assembly of Patterned Metal Oxide Thin Films via Microtransfer Molding and Electrochemical Deposition Techniques

Keith J. Stevenson; Greta J. Hurtt; Joseph T. Hupp

doi:10.1149/1.1390774

High Resolution Assembly of Patterned Metal Oxide Thin Films via Microtransfer Molding and Electrochemical Deposition Techniques

Keith J. Stevenson^*, Greta J. Hurtt, Joseph T. Hupp

^*Corresponding author for this work

Chemistry

Research output: Contribution to journal › Article › peer-review

23 Scopus citations

Abstract

A versatile method for preparing patterned thin films of metal oxides (MoO₃ and WO₃) and related materials on transparent, conductive indium-tin oxide (ITO) glass platforms is reported. Micrometer-sized features are formed by microtransfer molding of an optically transparent, thermally curable epoxy on ITO substrates followed by cathodic electrodeposition of the metal oxide from aqueous metal-hydrogen peroxide solutions. Atomic force microscopy was used to characterize the resulting microstructure and to examine effects of sintering on the patterned thin films.

Original language	English (US)
Pages (from-to)	175-177
Number of pages	3
Journal	Electrochemical and Solid-State Letters
Volume	2
Issue number	2-4
DOIs	https://doi.org/10.1149/1.1390774
State	Published - Apr 1999

ASJC Scopus subject areas

General Chemical Engineering
General Materials Science
Physical and Theoretical Chemistry
Electrochemistry
Electrical and Electronic Engineering

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@article{4085bd1df8004e6999f3aa1ca75e7f0a,

title = "High Resolution Assembly of Patterned Metal Oxide Thin Films via Microtransfer Molding and Electrochemical Deposition Techniques",

abstract = "A versatile method for preparing patterned thin films of metal oxides (MoO3 and WO3) and related materials on transparent, conductive indium-tin oxide (ITO) glass platforms is reported. Micrometer-sized features are formed by microtransfer molding of an optically transparent, thermally curable epoxy on ITO substrates followed by cathodic electrodeposition of the metal oxide from aqueous metal-hydrogen peroxide solutions. Atomic force microscopy was used to characterize the resulting microstructure and to examine effects of sintering on the patterned thin films.",

author = "Stevenson, {Keith J.} and Hurtt, {Greta J.} and Hupp, {Joseph T.}",

year = "1999",

month = apr,

doi = "10.1149/1.1390774",

language = "English (US)",

volume = "2",

pages = "175--177",

journal = "Electrochemical and Solid-State Letters",

issn = "1099-0062",

publisher = "Electrochemical Society Inc.",

number = "2-4",

}

TY - JOUR

T1 - High Resolution Assembly of Patterned Metal Oxide Thin Films via Microtransfer Molding and Electrochemical Deposition Techniques

AU - Stevenson, Keith J.

AU - Hurtt, Greta J.

AU - Hupp, Joseph T.

PY - 1999/4

Y1 - 1999/4

N2 - A versatile method for preparing patterned thin films of metal oxides (MoO3 and WO3) and related materials on transparent, conductive indium-tin oxide (ITO) glass platforms is reported. Micrometer-sized features are formed by microtransfer molding of an optically transparent, thermally curable epoxy on ITO substrates followed by cathodic electrodeposition of the metal oxide from aqueous metal-hydrogen peroxide solutions. Atomic force microscopy was used to characterize the resulting microstructure and to examine effects of sintering on the patterned thin films.

AB - A versatile method for preparing patterned thin films of metal oxides (MoO3 and WO3) and related materials on transparent, conductive indium-tin oxide (ITO) glass platforms is reported. Micrometer-sized features are formed by microtransfer molding of an optically transparent, thermally curable epoxy on ITO substrates followed by cathodic electrodeposition of the metal oxide from aqueous metal-hydrogen peroxide solutions. Atomic force microscopy was used to characterize the resulting microstructure and to examine effects of sintering on the patterned thin films.

UR - http://www.scopus.com/inward/record.url?scp=0033116444&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=0033116444&partnerID=8YFLogxK

U2 - 10.1149/1.1390774

DO - 10.1149/1.1390774

M3 - Article

AN - SCOPUS:0033116444

SN - 1099-0062

VL - 2

SP - 175

EP - 177

JO - Electrochemical and Solid-State Letters

JF - Electrochemical and Solid-State Letters

IS - 2-4

ER -

High Resolution Assembly of Patterned Metal Oxide Thin Films via Microtransfer Molding and Electrochemical Deposition Techniques

Abstract

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