High resolution backside imaging and thermography using a numerical aperture increasing lens

M. S. Ünlü*, S. B. Ippolito, M. G. Eraslan, S. A. Thorne, A. Vamivakas, B. B. Goldberg, Y. Leblebici

*Corresponding author for this work

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

Nanoscale imaging of defects in ICs is a great current technological challenge as IC feature sizes continue to shrink. We have developed novel techniques based on a Numerical Aperture Increasing Lens (NAIL) to study semiconductors at very high spatial resolution. The NAIL is placed on the surface of a sample and its convex surface effectively transforms the NAIL and the planar sample into an integrated solid immersion lens. Addition of the NAIL to a standard microscope increases the NA by a factor of square of the index n, to a maximum of NA = n. In silicon, the NA is increased by a factor of 13, to NA = 3.6. The spatial resolution improvement laterally is about a factor of 4 while longitudinally it is a factor of 12.5 corresponding to an overall reduction of the volume of interrogation by a factor of 50. Subsurface solid immersion microscopy can be applied to thermal imaging of blackbody radiation at IR wavelengths. We have designed, built, and demonstrated the use of a subsurface solid immersion microscope with capability for confocal imaging in 3-5 μm wavelength range and demonstrated a resolution of 1.4μm, representing the highest resolution subsurface thermography to date.

Original languageEnglish (US)
Title of host publication2004 NSTI Nanotechnology Conference and Trade Show - NSTI Nanotech 2004
EditorsM. Laudon, B. Romanowicz
Pages8-10
Number of pages3
Volume3
StatePublished - Nov 2 2004
Event2004 NSTI Nanotechnology Conference and Trade Show - NSTI Nanotech 2004 - Boston, MA, United States
Duration: Mar 7 2004Mar 11 2004

Other

Other2004 NSTI Nanotechnology Conference and Trade Show - NSTI Nanotech 2004
CountryUnited States
CityBoston, MA
Period3/7/043/11/04

Keywords

  • Failure analysis
  • High-resolution
  • Solid immersion lens
  • Thermal imaging

ASJC Scopus subject areas

  • Engineering(all)

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