TY - GEN
T1 - High Resolution Backside Thermography using a Numerical Aperture Increasing Lens
AU - Thorne, S.
AU - Ippolito, S.
AU - Eraslan, M.
AU - Goldberg, B.
AU - Ünlü, M. S.
AU - Leblebici, Y.
N1 - Funding Information:
This project is sponsored by the National Science Foundation under Award Number 0210752 (NIRT: Advanced Characterization Techniques in Optics for Nanostructures). We would also like to thank Tugba Demirci for help in design and Philippe Flückiger and the entire staff at the Center of Microtechnology at EPFL for help in the fabrication of test samples.
Publisher Copyright:
© 2003 ASM International. All rights reserved.
PY - 2003
Y1 - 2003
N2 - As the feature size in integrated circuits (ICs) become smaller, the techniques we use to localize defects must also progress to the level that they can resolve potential errors. Additionally, because most errors cannot be identified by visual inspection alone, it is necessary to develop techniques, such as thermography, with the capability of localizing failures to the specific component or defect at fault. This paper will review the theory and application of an advanced subsurface (through the substrate) analytical technique for IC failure analysis - solid immersion lens thermal emission microscopy.
AB - As the feature size in integrated circuits (ICs) become smaller, the techniques we use to localize defects must also progress to the level that they can resolve potential errors. Additionally, because most errors cannot be identified by visual inspection alone, it is necessary to develop techniques, such as thermography, with the capability of localizing failures to the specific component or defect at fault. This paper will review the theory and application of an advanced subsurface (through the substrate) analytical technique for IC failure analysis - solid immersion lens thermal emission microscopy.
UR - http://www.scopus.com/inward/record.url?scp=6344246702&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=6344246702&partnerID=8YFLogxK
U2 - 10.31399/asm.cp.istfa2003p0014
DO - 10.31399/asm.cp.istfa2003p0014
M3 - Conference contribution
AN - SCOPUS:6344246702
T3 - Conference Proceedings from the International Symposium for Testing and Failure Analysis
SP - 14
EP - 17
BT - ISTFA 2003
PB - ASM International
T2 - 29th International Symposium for Testing and Failure Analysis, ISTFA 2003
Y2 - 2 November 2003 through 6 November 2003
ER -