High spatial resolution subsurface thermal emission microscopy

Stephen B. Ippolito*, Shawn A. Thorne, Mesut G. Eraslan, Bennett B. Goldberg, M. Selim Ünlü, Yusuf Leblebici

*Corresponding author for this work

Research output: Contribution to journalConference articlepeer-review

3 Scopus citations

Abstract

The improvement the Numerical Aperture Increasing Lens (NAIL) which yields in thermal emission microscopy of Si ICs was demonstrated. The theoretical lateral spatial resolution limit was 2.5 μm for conventional thermal emission microscopes operating at wavelengths up to 5μm. This paper experimentally demonstrates a lateral sptial resolution of better than 1.6 μm and a longitudinal spatial resolution of better than 5.2 μm.

Original languageEnglish (US)
Pages (from-to)738-739
Number of pages2
JournalConference Proceedings - Lasers and Electro-Optics Society Annual Meeting-LEOS
Volume2
StatePublished - 2003
Event2003 IEEE LEOS Annual Meeting Conference Proceedings - TUCSON, AZ, United States
Duration: Oct 26 2003Oct 30 2003

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Electrical and Electronic Engineering

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