Abstract
We present a novel technique for drying surface micromachined microstructures after their wet chemical etch/release. This technique has been proven especially effective in release/drying devices with large surface contact areas (e.g. larger than 1×1 mm2). Here, magnetic force is used to actively levitate (deflect) released microstructures out of the substrate plane during the drying process, thereby preventing stiction and obtaining a high yield (100%). Without the active levitation, fewer than 10% microstructures are freed.
Original language | English (US) |
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Title of host publication | International Conference on Solid-State Sensors and Actuators, Proceedings |
Publisher | IEEE |
Pages | 241-244 |
Number of pages | 4 |
Volume | 1 |
State | Published - Jan 1 1997 |
Event | Proceedings of the 1997 International Conference on Solid-State Sensors and Actuators. Part 1 (of 2) - Chicago, IL, USA Duration: Jun 16 1997 → Jun 19 1997 |
Other
Other | Proceedings of the 1997 International Conference on Solid-State Sensors and Actuators. Part 1 (of 2) |
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City | Chicago, IL, USA |
Period | 6/16/97 → 6/19/97 |
ASJC Scopus subject areas
- Engineering(all)