Hot spot cooling using embedded thermoelectric coolers

G. Jeffrey Snyder*, Marco Soto, Randy Alley, David Koester, Bob Conner

*Corresponding author for this work

Research output: Chapter in Book/Report/Conference proceedingConference contribution

86 Scopus citations

Abstract

Localized areas of high heat flux on microprocessors produce hot spots that limit their reliability and performance. With increasingly dense circuits and the integration of high power processors with low power memory, non-uniform thermal profiles will become more dramatic and difficult to manage. Chip scale thermal solutions designed to keep hot spots below a critical temperature unnecessarily overcool the rest of the CPU and add to heat-sink load. Localized hot spot cooling solutions, even active systems that contribute some additional heat, can do a better job controlling hot spot temperatures when efficiently integrated with a heat spreader. Embedded thermoelectric cooling (eTEC) is a promising approach to reduce the temperature of highly localized, high heat flux hot spots generated by today's advanced processors.

Original languageEnglish (US)
Title of host publicationTwenty-Second Annual IEEE Semiconductor Thermal Measurement And Management Symposium, SEMI-THERM 2006
Pages135-143
Number of pages9
Volume2006
StatePublished - Oct 24 2006
Event22nd Annual IEEE Semiconductor Thermal Measurement and Management, SEMI-THERM 2006 - Dallas, TX, United States
Duration: Mar 14 2006Mar 16 2006

Other

Other22nd Annual IEEE Semiconductor Thermal Measurement and Management, SEMI-THERM 2006
CountryUnited States
CityDallas, TX
Period3/14/063/16/06

Keywords

  • ETEC
  • Embedded thermoelectric cooler
  • Localized hot spot cooling
  • Peltier Cooling
  • Thermoelectric

ASJC Scopus subject areas

  • Instrumentation
  • Electrical and Electronic Engineering

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