Abstract
Localized areas of high heat flux on microprocessors produce hot spots that limit their reliability and performance. With increasingly dense circuits and the integration of high power processors with low power memory, non-uniform thermal profiles will become more dramatic and difficult to manage. Chip scale thermal solutions designed to keep hot spots below a critical temperature unnecessarily overcool the rest of the CPU and add to heat-sink load. Localized hot spot cooling solutions, even active systems that contribute some additional heat, can do a better job controlling hot spot temperatures when efficiently integrated with a heat spreader. Embedded thermoelectric cooling (eTEC) is a promising approach to reduce the temperature of highly localized, high heat flux hot spots generated by today's advanced processors.
| Original language | English (US) |
|---|---|
| Title of host publication | IMAPS International Conference and Exhibition on Device Packaging - Co-located with the Global Business Council, GBC 2006 Spring Conference |
| State | Published - Dec 1 2006 |
| Event | IMAPS International Conference and Exhibition on Device Packaging - Co-located with the Spring Conference on Global Business Council, GBC 2006 - Scottsdale, AZ, United States Duration: Mar 20 2006 → Mar 23 2006 |
Other
| Other | IMAPS International Conference and Exhibition on Device Packaging - Co-located with the Spring Conference on Global Business Council, GBC 2006 |
|---|---|
| Country/Territory | United States |
| City | Scottsdale, AZ |
| Period | 3/20/06 → 3/23/06 |
Keywords
- Embedded thermoelectric cooler
- ETEC
- Localized hot spot cooling
- Peltier cooling
- Thermoelectric
ASJC Scopus subject areas
- Surfaces, Coatings and Films