Hot spot cooling using embedded thermoelectric coolers

G. Jeffrey Snyder; Marco Soto; Randy Alley; David Koester; Bob Conner

Hot spot cooling using embedded thermoelectric coolers

G. Jeffrey Snyder, Marco Soto, Randy Alley, David Koester, Bob Conner

Materials Science and Engineering

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Abstract

Localized areas of high heat flux on microprocessors produce hot spots that limit their reliability and performance. With increasingly dense circuits and the integration of high power processors with low power memory, non-uniform thermal profiles will become more dramatic and difficult to manage. Chip scale thermal solutions designed to keep hot spots below a critical temperature unnecessarily overcool the rest of the CPU and add to heat-sink load. Localized hot spot cooling solutions, even active systems that contribute some additional heat, can do a better job controlling hot spot temperatures when efficiently integrated with a heat spreader. Embedded thermoelectric cooling (eTEC) is a promising approach to reduce the temperature of highly localized, high heat flux hot spots generated by today's advanced processors.

Original language	English (US)
Title of host publication	IMAPS International Conference and Exhibition on Device Packaging - Co-located with the Global Business Council, GBC 2006 Spring Conference
State	Published - Dec 1 2006
Event	IMAPS International Conference and Exhibition on Device Packaging - Co-located with the Spring Conference on Global Business Council, GBC 2006 - Scottsdale, AZ, United States Duration: Mar 20 2006 → Mar 23 2006

Other

Other	IMAPS International Conference and Exhibition on Device Packaging - Co-located with the Spring Conference on Global Business Council, GBC 2006
Country/Territory	United States
City	Scottsdale, AZ
Period	3/20/06 → 3/23/06

Keywords

Embedded thermoelectric cooler
ETEC
Localized hot spot cooling
Peltier cooling
Thermoelectric

ASJC Scopus subject areas

Surfaces, Coatings and Films

Cite this

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title = "Hot spot cooling using embedded thermoelectric coolers",

abstract = "Localized areas of high heat flux on microprocessors produce hot spots that limit their reliability and performance. With increasingly dense circuits and the integration of high power processors with low power memory, non-uniform thermal profiles will become more dramatic and difficult to manage. Chip scale thermal solutions designed to keep hot spots below a critical temperature unnecessarily overcool the rest of the CPU and add to heat-sink load. Localized hot spot cooling solutions, even active systems that contribute some additional heat, can do a better job controlling hot spot temperatures when efficiently integrated with a heat spreader. Embedded thermoelectric cooling (eTEC) is a promising approach to reduce the temperature of highly localized, high heat flux hot spots generated by today's advanced processors.",

keywords = "Embedded thermoelectric cooler, ETEC, Localized hot spot cooling, Peltier cooling, Thermoelectric",

author = "Snyder, {G. Jeffrey} and Marco Soto and Randy Alley and David Koester and Bob Conner",

year = "2006",

month = dec,

day = "1",

language = "English (US)",

booktitle = "IMAPS International Conference and Exhibition on Device Packaging - Co-located with the Global Business Council, GBC 2006 Spring Conference",

note = "IMAPS International Conference and Exhibition on Device Packaging - Co-located with the Spring Conference on Global Business Council, GBC 2006 ; Conference date: 20-03-2006 Through 23-03-2006",

}

Snyder, GJ, Soto, M, Alley, R, Koester, D & Conner, B 2006, Hot spot cooling using embedded thermoelectric coolers. in IMAPS International Conference and Exhibition on Device Packaging - Co-located with the Global Business Council, GBC 2006 Spring Conference. IMAPS International Conference and Exhibition on Device Packaging - Co-located with the Spring Conference on Global Business Council, GBC 2006, Scottsdale, AZ, United States, 3/20/06.

TY - GEN

T1 - Hot spot cooling using embedded thermoelectric coolers

AU - Snyder, G. Jeffrey

AU - Soto, Marco

AU - Alley, Randy

AU - Koester, David

AU - Conner, Bob

PY - 2006/12/1

Y1 - 2006/12/1

N2 - Localized areas of high heat flux on microprocessors produce hot spots that limit their reliability and performance. With increasingly dense circuits and the integration of high power processors with low power memory, non-uniform thermal profiles will become more dramatic and difficult to manage. Chip scale thermal solutions designed to keep hot spots below a critical temperature unnecessarily overcool the rest of the CPU and add to heat-sink load. Localized hot spot cooling solutions, even active systems that contribute some additional heat, can do a better job controlling hot spot temperatures when efficiently integrated with a heat spreader. Embedded thermoelectric cooling (eTEC) is a promising approach to reduce the temperature of highly localized, high heat flux hot spots generated by today's advanced processors.

AB - Localized areas of high heat flux on microprocessors produce hot spots that limit their reliability and performance. With increasingly dense circuits and the integration of high power processors with low power memory, non-uniform thermal profiles will become more dramatic and difficult to manage. Chip scale thermal solutions designed to keep hot spots below a critical temperature unnecessarily overcool the rest of the CPU and add to heat-sink load. Localized hot spot cooling solutions, even active systems that contribute some additional heat, can do a better job controlling hot spot temperatures when efficiently integrated with a heat spreader. Embedded thermoelectric cooling (eTEC) is a promising approach to reduce the temperature of highly localized, high heat flux hot spots generated by today's advanced processors.

KW - Embedded thermoelectric cooler

KW - ETEC

KW - Localized hot spot cooling

KW - Peltier cooling

KW - Thermoelectric

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M3 - Conference contribution

AN - SCOPUS:84877011667

BT - IMAPS International Conference and Exhibition on Device Packaging - Co-located with the Global Business Council, GBC 2006 Spring Conference

T2 - IMAPS International Conference and Exhibition on Device Packaging - Co-located with the Spring Conference on Global Business Council, GBC 2006

Y2 - 20 March 2006 through 23 March 2006

ER -

Hot spot cooling using embedded thermoelectric coolers

Abstract

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Keywords

ASJC Scopus subject areas

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