Human Activity Recognition SoC for AR/VR with Integrated Neural Sensing, AI Classifier and Chained Infrared Communication for Multi-chip Collaboration

Yijie Wei*, Xi Chen, Jie Gu

*Corresponding author for this work

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

This paper presents a distributed multi-chip human activity recognition system for Virtual Reality (VR) and Augmented Reality (AR) applications. A comprehensive solution is delivered including AI core for classification, analog sensing for neural activity detection and infrared data communication for multi-chip collaboration. A 65nm test chip is fabricated and distributed across the body area to demonstrate the low power, low latency, and camera-free features of the target applications.

Original languageEnglish (US)
Title of host publication2023 IEEE Symposium on VLSI Technology and Circuits, VLSI Technology and Circuits 2023
PublisherInstitute of Electrical and Electronics Engineers Inc.
ISBN (Electronic)9784863488069
DOIs
StatePublished - 2023
Event2023 IEEE Symposium on VLSI Technology and Circuits, VLSI Technology and Circuits 2023 - Kyoto, Japan
Duration: Jun 11 2023Jun 16 2023

Publication series

NameDigest of Technical Papers - Symposium on VLSI Technology
Volume2023-June
ISSN (Print)0743-1562

Conference

Conference2023 IEEE Symposium on VLSI Technology and Circuits, VLSI Technology and Circuits 2023
Country/TerritoryJapan
CityKyoto
Period6/11/236/16/23

ASJC Scopus subject areas

  • Electrical and Electronic Engineering

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