Identification of deformation mechanisms responsible for failure in incremental forming using a damage based fracture model

Rajiv Malhotra*, Liang Xue, Jian Cao, Ted Belytschko

*Corresponding author for this work

Research output: Chapter in Book/Report/Conference proceedingConference contribution

4 Scopus citations

Abstract

Single Point Incremental forming (SPIF) has generated significant interest recently due to its increased formability and greater process flexibility. However, the complicated deformation me chanisms involved in SPIF have prevented conclusive identification of the primary mechanisms responsible for failure. This work successfully predicts the forming forces and occurrence of failure in SPIF using explicit FEA with a damage based fracture model in which failure envelope depends on the hydrostatic pressure and the Lode angle. Furthermore it is shown that through-the-thickness shear is primarily responsible for failure in SPIF. Simulations are also performed to form the same component using SPIF and using a conventional punch and die, and a comparison is made between the dominant mechanisms of failure in the two processes. Furthermore, it is shown that reduction of tool-sheet friction can delay fracture in SPIF and the mechanism behind this effect is discussed as well.

Original languageEnglish (US)
Title of host publication8th International Conference and Workshop on Numerical Simulation of 3D Sheet Metal Forming Processes, NUMISHEET 2011
Pages469-476
Number of pages8
Volume1383
DOIs
StatePublished - Sep 19 2011
Event8th International Conference and Workshop on Numerical Simulation of 3D Sheet Metal Forming Processes, NUMISHEET 2011 - Seoul, Korea, Republic of
Duration: Aug 21 2011Aug 26 2011

Other

Other8th International Conference and Workshop on Numerical Simulation of 3D Sheet Metal Forming Processes, NUMISHEET 2011
CountryKorea, Republic of
CitySeoul
Period8/21/118/26/11

Keywords

  • Fracture
  • Friction
  • Incremental forming
  • Through-the-thickness shear

ASJC Scopus subject areas

  • Physics and Astronomy(all)

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