Impact of interfacial chemistry on adhesion and electromigration in Cu interconnects

Ying Zhou*, Tracey Scherban, Guanghai Xu, Jun He, Barbara Miner, Chia Hong Jan, Andrew Ott, Jennifer O'Loughlin, Doug Ingerly, Jihperng Leu

*Corresponding author for this work

Research output: Contribution to journalConference articlepeer-review

6 Scopus citations

Fingerprint

Dive into the research topics of 'Impact of interfacial chemistry on adhesion and electromigration in Cu interconnects'. Together they form a unique fingerprint.

Keyphrases

Material Science