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Impact of interfacial chemistry on adhesion and electromigration in Cu interconnects
Ying Zhou*, Tracey Scherban, Guanghai Xu, Jun He, Barbara Miner, Chia Hong Jan, Andrew Ott, Jennifer O'Loughlin, Doug Ingerly, Jihperng Leu
*Corresponding author for this work
Research output: Contribution to journal › Conference article › peer-review
4
Scopus
citations