Impact of interfacial chemistry on adhesion and electromigration in Cu interconnects

Ying Zhou*, Tracey Scherban, Guanghai Xu, Jun He, Barbara Miner, Chia Hong Jan, Andrew Ott, Jennifer O'Loughlin, Doug Ingerly, Jihperng Leu

*Corresponding author for this work

Research output: Contribution to journalConference articlepeer-review

4 Scopus citations

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Chemical Compounds

Engineering & Materials Science