In-pixel AI for lossy data compression at source for X-ray detectors

Manuel B. Valentin, Giuseppe Di Guglielmo*, Danny Noonan, Priyanka Dilip, Panpan Huang, Adam Quinn, Thomas Zimmerman, Davide Braga, Seda Ogrenci, Chris Jacobsen, Nhan Tran, Farah Fahim

*Corresponding author for this work

Research output: Contribution to journalArticlepeer-review

5 Scopus citations

Abstract

Integrating neural networks for data compression directly in the Read-Out Integrated Circuits (ROICs), i.e. the pixelated front-end, would result in a significant reduction in off-chip data transfer, overcoming the I/O bottleneck. Our ROIC test chip (AI-In-Pixel-65) is designed in a 65 nm Low Power CMOS process for the readout of pixelated X-ray detectors. Each pixel consists of an analog front-end for signal processing and a 10b analog-to-digital converter operating at 100KSPS. We compare two non-reconfigurable techniques, Principal Component Analysis (PCA) and an AutoEncoder (AE) as lossy data compression engines implemented within the pixelated area. The PCA algorithm achieves 50× compression, adds one clock cycle latency, and results in a 21% increase in the pixel area. The AE achieves 70× compression, adds 30 clock cycle latency, and results in a similar area increase.

Funding

We acknowledge the Fast Machine Learning collective as an open community of multi-domain experts and collaborators. This community was important for the development of this project. GDG, DN, AQ, DB, NT and FF are supported by Fermi Research Alliance, LLC under Contract No. DE-AC02-07CH11359 with the Department of Energy (DOE), Office of Science, Office of High Energy Physics. NT and FF are also supported the DOE Early Career Research Program. NT is also supported by the DOE Office of Science, Office of Advanced Scientific Computing Research under the “Real-time Data Reduction Codesign at the Extreme Edge for Science” Project (DE-FOA-0002501). DB and AQ are also supported by the DOE Office of Science under the Microelectronics Co-Design Research Project “Hybrid Cryogenic Detector Architectures for Sensing and Edge Computing enabled by new Fabrication Processes” (LAB 21-2491).

Keywords

  • Data-compression at source
  • Machine-learning in pixel sensors
  • Microscopy
  • Ptychography
  • Read-out integrated circuits
  • X-ray detectors

ASJC Scopus subject areas

  • Nuclear and High Energy Physics
  • Instrumentation

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