Initial results of a novel pre-deposition seeding technique for achieving an ultra-high nucleation density for CVD diamond growth

A. P. Malshe*, R. A. Beera, A. A. Khanolkar, W. D. Brown, H. A. Naseem

*Corresponding author for this work

Research output: Contribution to journalArticle

4 Scopus citations

Abstract

The unique thermal properties of diamond, along with the ability to deposit it over large areas, make it an appropriate candidate for electronic packaging and other thermal management applications. In a recent exploration, our group observed defects in diamond films, referred to as "microcavities". Microcavities are essentially voids in CVD diamond resulting from the growth of randomly-oriented grains. These microcavities present serious challenges to the fabrication of high-density electronic packages when they appear at the surface of the film/substrate. Two approaches for solving the microcavity problem were explored; (1) "planarization by filling" and (2) enhancement of the nucleation density. Results of the first approach have been reported elsewhere. The latter approach, which is the subject of this paper, is based on an electrostatic seeding technique for uniformly depositing nanometer size diamond particles over the entire surface of any material of any shape to serve as nucleation sites for diamond growth. This approach to initiating diamond growth is inexpensive and simple. The resulting films are very dense, and both the number and size of the microcavities are significantly reduced. Details of the seeding technique and resulting diamond films, characterized using SEM, will be discussed.

Original languageEnglish (US)
Pages (from-to)430-434
Number of pages5
JournalDiamond and Related Materials
Volume6
Issue number2-4
DOIs
StatePublished - Mar 1997

Keywords

  • Diamond defects
  • Nucleation
  • Pre-treated substrates
  • Seeding

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Chemistry(all)
  • Mechanical Engineering
  • Materials Chemistry
  • Electrical and Electronic Engineering

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