Integrated circuit super-resolution failure analysis with solid immersion lenses

Kyle Vigil; Yang Lu; Abdulkadir Yurt; Tenzile Berkin Cilingiroglu; Thomas G. Bifano; M. Selim Ünlü; Bennett B. Goldberg

Integrated circuit super-resolution failure analysis with solid immersion lenses

Kyle Vigil, Yang Lu, Abdulkadir Yurt, Tenzile Berkin Cilingiroglu, Thomas G. Bifano, M. Selim Ünlü, Bennett B. Goldberg

Physics and Astronomy

Research output: Contribution to journal › Article › peer-review

5 Scopus citations

Abstract

Current backside imaging FA methods are unable to image the smallest technology-node devices already available. Next-generation backside FA will need to rely on SIL imaging, aberration correction with deformable mirrors, and LVI signal enhancement through interferometry. These resolution-enhancing, signal-enhancing, and aberration-reducing techniques can make backside FA a viable technology for current and future ICs.

Original language	English (US)
Pages (from-to)	26-32
Number of pages	7
Journal	Electronic Device Failure Analysis
Volume	16
Issue number	2
State	Published - Jan 1 2014

ASJC Scopus subject areas

Safety, Risk, Reliability and Quality
Electrical and Electronic Engineering

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Cite this

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title = "Integrated circuit super-resolution failure analysis with solid immersion lenses",

abstract = "Current backside imaging FA methods are unable to image the smallest technology-node devices already available. Next-generation backside FA will need to rely on SIL imaging, aberration correction with deformable mirrors, and LVI signal enhancement through interferometry. These resolution-enhancing, signal-enhancing, and aberration-reducing techniques can make backside FA a viable technology for current and future ICs.",

author = "Kyle Vigil and Yang Lu and Abdulkadir Yurt and Cilingiroglu, {Tenzile Berkin} and Bifano, {Thomas G.} and {\"U}nl{\"u}, {M. Selim} and Goldberg, {Bennett B.}",

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AU - Ünlü, M. Selim

AU - Goldberg, Bennett B.

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AB - Current backside imaging FA methods are unable to image the smallest technology-node devices already available. Next-generation backside FA will need to rely on SIL imaging, aberration correction with deformable mirrors, and LVI signal enhancement through interferometry. These resolution-enhancing, signal-enhancing, and aberration-reducing techniques can make backside FA a viable technology for current and future ICs.

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