TY - JOUR
T1 - Integrated circuit super-resolution failure analysis with solid immersion lenses
AU - Vigil, Kyle
AU - Lu, Yang
AU - Yurt, Abdulkadir
AU - Cilingiroglu, Tenzile Berkin
AU - Bifano, Thomas G.
AU - Ünlü, M. Selim
AU - Goldberg, Bennett B.
PY - 2014
Y1 - 2014
N2 - Current backside imaging FA methods are unable to image the smallest technology-node devices already available. Next-generation backside FA will need to rely on SIL imaging, aberration correction with deformable mirrors, and LVI signal enhancement through interferometry. These resolution-enhancing, signal-enhancing, and aberration-reducing techniques can make backside FA a viable technology for current and future ICs.
AB - Current backside imaging FA methods are unable to image the smallest technology-node devices already available. Next-generation backside FA will need to rely on SIL imaging, aberration correction with deformable mirrors, and LVI signal enhancement through interferometry. These resolution-enhancing, signal-enhancing, and aberration-reducing techniques can make backside FA a viable technology for current and future ICs.
UR - http://www.scopus.com/inward/record.url?scp=84903952966&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=84903952966&partnerID=8YFLogxK
M3 - Article
AN - SCOPUS:84903952966
SN - 1537-0755
VL - 16
SP - 26
EP - 32
JO - Electronic Device Failure Analysis
JF - Electronic Device Failure Analysis
IS - 2
ER -