Current backside imaging FA methods are unable to image the smallest technology-node devices already available. Next-generation backside FA will need to rely on SIL imaging, aberration correction with deformable mirrors, and LVI signal enhancement through interferometry. These resolution-enhancing, signal-enhancing, and aberration-reducing techniques can make backside FA a viable technology for current and future ICs.
|Original language||English (US)|
|Number of pages||7|
|Journal||Electronic Device Failure Analysis|
|State||Published - Jan 1 2014|
ASJC Scopus subject areas
- Safety, Risk, Reliability and Quality
- Electrical and Electronic Engineering