Integrated circuit super-resolution failure analysis with solid immersion lenses

Kyle Vigil, Yang Lu, Abdulkadir Yurt, Tenzile Berkin Cilingiroglu, Thomas G. Bifano, M. Selim Ünlü, Bennett B. Goldberg

Research output: Contribution to journalArticlepeer-review

5 Scopus citations

Abstract

Current backside imaging FA methods are unable to image the smallest technology-node devices already available. Next-generation backside FA will need to rely on SIL imaging, aberration correction with deformable mirrors, and LVI signal enhancement through interferometry. These resolution-enhancing, signal-enhancing, and aberration-reducing techniques can make backside FA a viable technology for current and future ICs.

Original languageEnglish (US)
Pages (from-to)26-32
Number of pages7
JournalElectronic Device Failure Analysis
Volume16
Issue number2
StatePublished - Jan 1 2014

ASJC Scopus subject areas

  • Safety, Risk, Reliability and Quality
  • Electrical and Electronic Engineering

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