Integrated circuit white space redistribution for temperature optimization

Yuankai Chen*, Hai Zhou, Robert P. Dick

*Corresponding author for this work

Research output: Chapter in Book/Report/Conference proceedingConference contribution

1 Scopus citations

Abstract

Thermal problems are important for integrated circuits with high power densities. Three-dimensional stacked-wafer integrated circuit technology reduces interconnect lengths and improves performance compared to two-dimensional integration. However, it intensifies thermal problems. One remedy is to redistribute white space during floorplanning. In this paper, we propose a two-phase algorithm to redistribute white space. In the first phase, the lateral heat flow white space redistribution problem is formulated as a minimum cycle ratio problem, in which the maximum power density is minimized. Since this phase only considers lateral heat flow, it also works for traditional two-dimensional integrated circuits. In the second phase, to consider inter-layer heat flow in three-dimensional integrated circuits, we discretize the chip into an array of tiles and use a dynamic programming algorithm to minimize the maximum stacked tile power consumption. We compared our algorithms with a previously proposed technique based on mathematical programming. Our iterative minimum cycle ratio algorithm achieves 35% more reduction in peak temperature. Our two-phase algorithm achieves 4.21x reduction in peak temperature for three-dimensional integrated circuits compared to applying the first phase, alone.

Original languageEnglish (US)
Title of host publicationProceedings - Design, Automation and Test in Europe Conference and Exhibition, DATE 2011
Pages613-618
Number of pages6
StatePublished - May 31 2011
Event14th Design, Automation and Test in Europe Conference and Exhibition, DATE 2011 - Grenoble, France
Duration: Mar 14 2011Mar 18 2011

Other

Other14th Design, Automation and Test in Europe Conference and Exhibition, DATE 2011
CountryFrance
CityGrenoble
Period3/14/113/18/11

ASJC Scopus subject areas

  • Engineering(all)

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