Integrated multilayer sputter-induced 45°YBa2Cu 3O7-x grain boundary junctions

B. V. Vuchic*, K. L. Merkle, K. A. Dean, D. B. Buchholz, R. P.H. Chang, L. D. Marks

*Corresponding author for this work

Research output: Contribution to journalArticlepeer-review

8 Scopus citations


A versatile multilayer technique has been developed to form 45°YBa 2Cu3O7-x [001] tilt grain boundary junctions on LaAlO3 substrates. An epitaxial MgO layer is initially deposited on a (100) LaAlO3substrate using pulsed organometallic beam epitaxy (POMBE). After a pregrowth sputter treatment, an YBa2Cu 3O7-x thin film is then grown using POMBE. The resultant film is c-axis oriented with a cube-on-cube orientation over the unsputtered portion of the MgO, and rotated by 45°about the [001] axis on the sputtered region of the substrate. The resulting grain boundary junction shows weak-link behavior. The advantage of this technique is the ability to place the grain boundary anywhere on the substrate in any configuration, and the potential to use any substrate upon which MgO can be epitaxially grown.

Original languageEnglish (US)
Pages (from-to)1013
Number of pages1
JournalApplied Physics Letters
StatePublished - 1995

ASJC Scopus subject areas

  • Physics and Astronomy (miscellaneous)


Dive into the research topics of 'Integrated multilayer sputter-induced 45°YBa<sub>2</sub>Cu <sub>3</sub>O<sub>7-x</sub> grain boundary junctions'. Together they form a unique fingerprint.

Cite this