Integrating thermocouple sensors into 3D ICs

Dawei Li, Ji Hoon Kim, Seda Ogrenci Memik

Research output: Chapter in Book/Report/Conference proceedingConference contribution

7 Scopus citations

Abstract

In this paper, we present a novel architecture for embedding bi-metallic thermocouple based temperature sensors into 3D IC stacks. To the best of our knowledge this is the first work addressing this specific integration problem. Our architecture uses dedicated vias to thermally couple sensors in the metal layer with the hotspots to be monitored in the active layer throughout the multi-stack structures. We propose a low cost solution by leveraging a fraction of existing thermal TSVs for this purpose. Through thermal modeling and simulation using a state-of-the-art tool (FloTHERM), we demonstrate that we can achieve high accuracy (less than 1°C error) in temperature tracking while still maintaining the effectiveness of the thermal TSVs in heat management (conforming to a fixed peak temperature threshold of 95°C).

Original languageEnglish (US)
Title of host publication2013 IEEE 31st International Conference on Computer Design, ICCD 2013
PublisherIEEE Computer Society
Pages221-226
Number of pages6
ISBN (Print)9781479929870
DOIs
StatePublished - Jan 1 2013
Event2013 IEEE 31st International Conference on Computer Design, ICCD 2013 - Asheville, NC, United States
Duration: Oct 6 2013Oct 9 2013

Publication series

Name2013 IEEE 31st International Conference on Computer Design, ICCD 2013

Other

Other2013 IEEE 31st International Conference on Computer Design, ICCD 2013
CountryUnited States
CityAsheville, NC
Period10/6/1310/9/13

Keywords

  • 3D IC
  • TSV (through silicon via)
  • bi-metallic thermocouple
  • thermal monitoring

ASJC Scopus subject areas

  • Computer Graphics and Computer-Aided Design
  • Hardware and Architecture

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