Integration of a molecular viscosity model and a continuum EHL solution for simulation of thin film lubrication

A. Martini*, Y. Liu, R. Q. Snurr, Q. Wang

*Corresponding author for this work

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

We present a simulation approach for thin film lubrication that integrates a molecular model of the film thickness-viscosity relationship in thin films with a continuum elastohydrodynamic (EHL) lubricated contact solution. Molecular simulation is used to characterize the effect of film thickness on viscosity in terms of solidification, shear thinning, and oscillation. This relationship is then incorporated into a traditional, continuum EHL solution. Film thickness distributions predicted by this integrated model are evaluated. It is found that the effect of the molecular film thickness-viscosity model is small compared to the increase in viscosity with pressure predicted by the Barus equation.

Original languageEnglish (US)
Title of host publicationProceedings of the World Tribology Congress III - 2005
PublisherAmerican Society of Mechanical Engineers
Pages721-722
Number of pages2
ISBN (Print)0791842029, 9780791842027
DOIs
StatePublished - 2005
Event2005 World Tribology Congress III - Washington, D.C., United States
Duration: Sep 12 2005Sep 16 2005

Publication series

NameProceedings of the World Tribology Congress III - 2005

Other

Other2005 World Tribology Congress III
CountryUnited States
CityWashington, D.C.
Period9/12/059/16/05

ASJC Scopus subject areas

  • Engineering(all)

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