Integration of a molecular viscosity model and a continuum EHL solution for simulation of thin film lubrication

A. Martini; Y. Liu; R. Q. Snurr; Q. Wang

doi:10.1115/wtc2005-63091

Integration of a molecular viscosity model and a continuum EHL solution for simulation of thin film lubrication

A. Martini^*, Y. Liu, R. Q. Snurr, Q. Wang

^*Corresponding author for this work

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Abstract

We present a simulation approach for thin film lubrication that integrates a molecular model of the film thickness-viscosity relationship in thin films with a continuum elastohydrodynamic (EHL) lubricated contact solution. Molecular simulation is used to characterize the effect of film thickness on viscosity in terms of solidification, shear thinning, and oscillation. This relationship is then incorporated into a traditional, continuum EHL solution. Film thickness distributions predicted by this integrated model are evaluated. It is found that the effect of the molecular film thickness-viscosity model is small compared to the increase in viscosity with pressure predicted by the Barus equation.

Original language	English (US)
Title of host publication	Proceedings of the World Tribology Congress III - 2005
Publisher	American Society of Mechanical Engineers
Pages	721-722
Number of pages	2
ISBN (Print)	0791842029, 9780791842027
DOIs	https://doi.org/10.1115/wtc2005-63091
State	Published - 2005
Event	2005 World Tribology Congress III - Washington, D.C., United States Duration: Sep 12 2005 → Sep 16 2005

Publication series

Name	Proceedings of the World Tribology Congress III - 2005

Other

Other	2005 World Tribology Congress III
Country/Territory	United States
City	Washington, D.C.
Period	9/12/05 → 9/16/05

ASJC Scopus subject areas

General Engineering

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10.1115/wtc2005-63091

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Martini, A., Liu, Y., Snurr, R. Q., & Wang, Q. (2005). Integration of a molecular viscosity model and a continuum EHL solution for simulation of thin film lubrication. In Proceedings of the World Tribology Congress III - 2005 (pp. 721-722). (Proceedings of the World Tribology Congress III - 2005). American Society of Mechanical Engineers. https://doi.org/10.1115/wtc2005-63091

@inproceedings{ac74afa5d3c0410d9145e01a7de478a9,

title = "Integration of a molecular viscosity model and a continuum EHL solution for simulation of thin film lubrication",

abstract = "We present a simulation approach for thin film lubrication that integrates a molecular model of the film thickness-viscosity relationship in thin films with a continuum elastohydrodynamic (EHL) lubricated contact solution. Molecular simulation is used to characterize the effect of film thickness on viscosity in terms of solidification, shear thinning, and oscillation. This relationship is then incorporated into a traditional, continuum EHL solution. Film thickness distributions predicted by this integrated model are evaluated. It is found that the effect of the molecular film thickness-viscosity model is small compared to the increase in viscosity with pressure predicted by the Barus equation.",

author = "A. Martini and Y. Liu and Snurr, {R. Q.} and Q. Wang",

year = "2005",

doi = "10.1115/wtc2005-63091",

language = "English (US)",

isbn = "0791842029",

series = "Proceedings of the World Tribology Congress III - 2005",

publisher = "American Society of Mechanical Engineers",

pages = "721--722",

booktitle = "Proceedings of the World Tribology Congress III - 2005",

note = "2005 World Tribology Congress III ; Conference date: 12-09-2005 Through 16-09-2005",

}

Martini, A, Liu, Y, Snurr, RQ & Wang, Q 2005, Integration of a molecular viscosity model and a continuum EHL solution for simulation of thin film lubrication. in Proceedings of the World Tribology Congress III - 2005. Proceedings of the World Tribology Congress III - 2005, American Society of Mechanical Engineers, pp. 721-722, 2005 World Tribology Congress III, Washington, D.C., United States, 9/12/05. https://doi.org/10.1115/wtc2005-63091

Integration of a molecular viscosity model and a continuum EHL solution for simulation of thin film lubrication. / Martini, A.; Liu, Y.; Snurr, R. Q. et al.
Proceedings of the World Tribology Congress III - 2005. American Society of Mechanical Engineers, 2005. p. 721-722 (Proceedings of the World Tribology Congress III - 2005).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

TY - GEN

T1 - Integration of a molecular viscosity model and a continuum EHL solution for simulation of thin film lubrication

AU - Martini, A.

AU - Liu, Y.

AU - Snurr, R. Q.

AU - Wang, Q.

PY - 2005

Y1 - 2005

N2 - We present a simulation approach for thin film lubrication that integrates a molecular model of the film thickness-viscosity relationship in thin films with a continuum elastohydrodynamic (EHL) lubricated contact solution. Molecular simulation is used to characterize the effect of film thickness on viscosity in terms of solidification, shear thinning, and oscillation. This relationship is then incorporated into a traditional, continuum EHL solution. Film thickness distributions predicted by this integrated model are evaluated. It is found that the effect of the molecular film thickness-viscosity model is small compared to the increase in viscosity with pressure predicted by the Barus equation.

AB - We present a simulation approach for thin film lubrication that integrates a molecular model of the film thickness-viscosity relationship in thin films with a continuum elastohydrodynamic (EHL) lubricated contact solution. Molecular simulation is used to characterize the effect of film thickness on viscosity in terms of solidification, shear thinning, and oscillation. This relationship is then incorporated into a traditional, continuum EHL solution. Film thickness distributions predicted by this integrated model are evaluated. It is found that the effect of the molecular film thickness-viscosity model is small compared to the increase in viscosity with pressure predicted by the Barus equation.

UR - http://www.scopus.com/inward/record.url?scp=33144465544&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=33144465544&partnerID=8YFLogxK

U2 - 10.1115/wtc2005-63091

DO - 10.1115/wtc2005-63091

M3 - Conference contribution

AN - SCOPUS:33144465544

SN - 0791842029

SN - 9780791842027

T3 - Proceedings of the World Tribology Congress III - 2005

SP - 721

EP - 722

BT - Proceedings of the World Tribology Congress III - 2005

PB - American Society of Mechanical Engineers

T2 - 2005 World Tribology Congress III

Y2 - 12 September 2005 through 16 September 2005

ER -

Integration of a molecular viscosity model and a continuum EHL solution for simulation of thin film lubrication

Abstract

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