@inproceedings{6a85b3c502b24f4b8ccda15801a3e173,
title = "Interface characterization of al-cu micro-laminates fabricated by electrically-assisted roll bonding",
abstract = "Interface characteristics of Al/Cu micro-laminates fabricated by an Electrically-Assisted Roll Bonding (EARB) process were studied to understand the underlying physical/chemical phenomena that lead to bond strength enhancement when applying electrical current during deformation. Peel tests were conducted for the Al/Cu rollbonded laminates produced with no current and under 50A and 150A applied current. After peel tests using a micro-tensile machine, the fractured surfaces of both the Al and Cu-sides were examined using scanning electron microscopy (SEM) for fractography and SEM-based energy dispersive (EDS) analysis. Results revealed the strong dependence of the fracture path and its morphology on the strength of the bond, which is influenced by various phenomena occurring at the interface during EARB, such as microextrusion through surface micro-cracks, possible formation of intermetallic components and thermal softening during simultaneous application of strain and high current density.",
keywords = "Al/Cu bilayer, EBSD, Electrically-Assisted Roll Bonding (EARB), Joined interface",
author = "Marzyeh Moradi and Ng, {Man Kwan} and Taekyung Lee and Jian Cao and Picard, {Yoosuf N.}",
note = "Funding Information: Support from the National Science Foundation (CMMI grant # 1463204) is gratefully acknowledged. Publisher Copyright: Copyright {\textcopyright} 2016 by ASME.; ASME 2016 11th International Manufacturing Science and Engineering Conference, MSEC 2016 ; Conference date: 27-06-2016 Through 01-07-2016",
year = "2016",
doi = "10.1115/MSEC20168599",
language = "English (US)",
series = "ASME 2016 11th International Manufacturing Science and Engineering Conference, MSEC 2016",
publisher = "American Society of Mechanical Engineers",
booktitle = "Processing",
}