Interface characterization of al-cu micro-laminates fabricated by electrically-assisted roll bonding

Marzyeh Moradi, Man Kwan Ng, Taekyung Lee, Jian Cao, Yoosuf N. Picard

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

Interface characteristics of Al/Cu micro-laminates fabricated by an Electrically-Assisted Roll Bonding (EARB) process were studied to understand the underlying physical/chemical phenomena that lead to bond strength enhancement when applying electrical current during deformation. Peel tests were conducted for the Al/Cu rollbonded laminates produced with no current and under 50A and 150A applied current. After peel tests using a micro-tensile machine, the fractured surfaces of both the Al and Cu-sides were examined using scanning electron microscopy (SEM) for fractography and SEM-based energy dispersive (EDS) analysis. Results revealed the strong dependence of the fracture path and its morphology on the strength of the bond, which is influenced by various phenomena occurring at the interface during EARB, such as microextrusion through surface micro-cracks, possible formation of intermetallic components and thermal softening during simultaneous application of strain and high current density.

Original languageEnglish (US)
Title of host publicationProcessing
PublisherAmerican Society of Mechanical Engineers
ISBN (Electronic)9780791849897
DOIs
StatePublished - 2016
EventASME 2016 11th International Manufacturing Science and Engineering Conference, MSEC 2016 - Blacksburg, United States
Duration: Jun 27 2016Jul 1 2016

Publication series

NameASME 2016 11th International Manufacturing Science and Engineering Conference, MSEC 2016
Volume1

Other

OtherASME 2016 11th International Manufacturing Science and Engineering Conference, MSEC 2016
CountryUnited States
CityBlacksburg
Period6/27/167/1/16

Keywords

  • Al/Cu bilayer
  • EBSD
  • Electrically-Assisted Roll Bonding (EARB)
  • Joined interface

ASJC Scopus subject areas

  • Industrial and Manufacturing Engineering

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