Interface characterization of Al-Cu microlaminates fabricated by electrically assisted roll bonding

Marzyeh Moradi, Man Kwan Ng, Taekyung Lee, Jian Cao, Yoosuf N. Picard*

*Corresponding author for this work

Research output: Contribution to journalArticlepeer-review

2 Scopus citations

Abstract

Interface characteristics of Al/Cu microlaminates fabricated by an electrically assisted roll bonding (EARB) process were studied to understand the underlying physical/chemical phenomena that lead to bond strength enhancement when applying electrical current during deformation. Peel tests were conducted for the Al/Cu roll-bonded laminates produced under 0 A, 50 A, and 150 A applied current. After peel tests using a microtensile machine, the fractured surfaces of both the Al and Cu-sides were examined using scanning electron microscopy (SEM) for fractography and SEM-based energy dispersive (EDS) analysis. Results revealed the strong dependence of the fracture path and its morphology on the strength of the bond, which is influenced by various phenomena occurring at the interface during EARB, such as microextrusion through surface microcracks, possible formation of intermetallic components and thermal softening during simultaneous application of strain and high current density.

Original languageEnglish (US)
Article number031001
JournalJournal of Micro and Nano-Manufacturing
Volume5
Issue number3
DOIs
StatePublished - Sep 1 2017

Keywords

  • Al/Cu bilayer
  • Electrically assisted roll bonding (EARB)
  • Joined interface

ASJC Scopus subject areas

  • Mechanics of Materials
  • Process Chemistry and Technology
  • Industrial and Manufacturing Engineering

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