Interface mechanics of adhesiveless microtransfer printing processes

H. J. Kim-Lee, A. Carlson, D. S. Grierson, J. A. Rogers, K. T. Turner

Research output: Contribution to journalArticlepeer-review

33 Scopus citations

Abstract

Microtransfer printing is a versatile process for retrieving, transferring, and placing nanomembranes of various materials on a diverse set of substrates. The process relies on the ability to preferentially propagate a crack along specific interfaces at different stages in the process. Here, we report a mechanics-based model that examines the factors that determine which interface a crack will propagate along in microtransfer printing with a soft elastomer stamp. The model is described and validated through comparison to experimental measurements. The effects of various factors, including interface toughness, stamp geometry, flaw sizes at the interfaces, and nanomembrane thickness, on the effectiveness of transfer printing are investigated using a fracture-mechanics framework and finite element modeling. The modeling results agree with experimental measurements in which the effects of interface toughness and nanomembranes thickness on the transfer printing yield were examined. The models presented can be used to guide the design of transfer printing processes.

Original languageEnglish (US)
Article number143513
JournalJournal of Applied Physics
Volume115
Issue number14
DOIs
StatePublished - Apr 14 2014

ASJC Scopus subject areas

  • Physics and Astronomy(all)

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