Interfacial cohesive fracture of Sn-Ag-Cu eutectic lead-free solder

Yao*, Leon M. Keer

*Corresponding author for this work

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

Significant reductions in the solder-joint interconnect size results in the increased volume fraction of brittle intermetallics in the joint. Previously, the prevalent failure mode in a solder joint was the ductile thermo-mechanical fracture of solder material due to repeated thermal cycling. In addition to this mode of failure the joints were also found to fail by brittle fracture near the solder-intermetallic interface. To predict and reduce the failure of a solder joint, a model that incorporates both plastic damage in bulk solder and solder-intermetallic interface failure is timely and useful to the electronics industry. Based on cohesive fracture theory, a 3D finite element model has been developed to predict the interfacial damage of different solder interconnects. Unified creep-plasticity theory is incorporated in the model considering the creep and hysteresis effects in solder bulk. Using the unified creep-plasticity-cohesive finite element model, the intermetallic-layer growth effect has been researched for different solders.

Original languageEnglish (US)
Title of host publicationMaterials Science and Technology Conference and Exhibition 2010, MS and T'10
Pages1430-1439
Number of pages10
StatePublished - Dec 1 2010
EventMaterials Science and Technology Conference and Exhibition 2010, MS and T'10 - Houston, TX, United States
Duration: Oct 17 2010Oct 21 2010

Publication series

NameMaterials Science and Technology Conference and Exhibition 2010, MS and T'10
Volume2

Other

OtherMaterials Science and Technology Conference and Exhibition 2010, MS and T'10
CountryUnited States
CityHouston, TX
Period10/17/1010/21/10

Keywords

  • ABAQUS
  • Cohesive
  • Crack
  • Finite element
  • Interface
  • Intermetallic layer
  • Solder
  • Unified creep and plasticity

ASJC Scopus subject areas

  • Materials Science (miscellaneous)

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