@inproceedings{db741b3fcca1462f9c0979999a99332f,
title = "Interfacial cohesive fracture of Sn-Ag-Cu eutectic lead-free solder",
abstract = "Significant reductions in the solder-joint interconnect size results in the increased volume fraction of brittle intermetallics in the joint. Previously, the prevalent failure mode in a solder joint was the ductile thermo-mechanical fracture of solder material due to repeated thermal cycling. In addition to this mode of failure the joints were also found to fail by brittle fracture near the solder-intermetallic interface. To predict and reduce the failure of a solder joint, a model that incorporates both plastic damage in bulk solder and solder-intermetallic interface failure is timely and useful to the electronics industry. Based on cohesive fracture theory, a 3D finite element model has been developed to predict the interfacial damage of different solder interconnects. Unified creep-plasticity theory is incorporated in the model considering the creep and hysteresis effects in solder bulk. Using the unified creep-plasticity-cohesive finite element model, the intermetallic-layer growth effect has been researched for different solders.",
keywords = "ABAQUS, Cohesive, Crack, Finite element, Interface, Intermetallic layer, Solder, Unified creep and plasticity",
author = "Yao and Keer, {Leon M.}",
year = "2010",
month = dec,
day = "1",
language = "English (US)",
isbn = "9781617820328",
series = "Materials Science and Technology Conference and Exhibition 2010, MS and T'10",
pages = "1430--1439",
booktitle = "Materials Science and Technology Conference and Exhibition 2010, MS and T'10",
note = "Materials Science and Technology Conference and Exhibition 2010, MS and T'10 ; Conference date: 17-10-2010 Through 21-10-2010",
}