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Interfacial microstructure and the kinetics of interfacial reaction in diffusion couples between Sn-Pb solder and Cu/Ni/Pd metallization
G. Ghosh
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Corresponding author for this work
Materials Science and Engineering
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Article
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peer-review
122
Scopus citations
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Dive into the research topics of 'Interfacial microstructure and the kinetics of interfacial reaction in diffusion couples between Sn-Pb solder and Cu/Ni/Pd metallization'. Together they form a unique fingerprint.
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Engineering & Materials Science
Growth kinetics
100%
Surface chemistry
90%
Metallizing
79%
Soldering alloys
67%
Activation energy
47%
Microstructure
46%
Electron microscopy
29%
Coarsening
27%
Coalescence
26%
Etching
24%
Intermetallics
24%
Eutectics
24%
Volume fraction
20%
Aging of materials
18%
Scanning
17%
Substrates
16%
Chemical Compounds
Solder
84%
Surface Chemistry
62%
Size Distribution
60%
Reaction Activation Energy
47%
Microstructure
46%
Thickening
42%
Diffusion
42%
Coalescence
37%
Eutectics
35%
Kinetics Type
31%
Etching
30%
Reaction Yield
27%
Hexagonal Space Group
26%
Time
24%
Length
20%
Volume
19%