Interfacial reaction between multicomponent lead-free solders and Ag, Cu, Ni, and Pd substrates

G. Ghosh

doi:10.1007/s11664-004-0108-8

Interfacial reaction between multicomponent lead-free solders and Ag, Cu, Ni, and Pd substrates

G. Ghosh^*

^*Corresponding author for this work

Materials Science and Engineering

Research output: Contribution to journal › Article › peer-review

33 Scopus citations

Abstract

The interfacial reaction between two prototype multicomponent lead-free solders, Sn-3.4Ag-1Bi-0.7Cu-4In and Sn-3.4Ag-3Bi-0.7Cu-4In (mass%), and Ag, Cu, Ni, and Pd substrates are studied at 250°C and 150°C. The microstructural characterization of the solder bumps is carried out by scanning electron microscopy (SEM) coupled with energy dispersive x-ray analysis. Ambient temperature, isotropic elastic properties (bulk, shear, and Young's moduli and Poisson's ratio) of these solders along with eutectic Sn-Ag, Sn-Bi, and Sn-Zn solders are measured. The Isotropic elastic moduli of multicomponent solders are very similar to the eutectic Sn-Ag solder. The measured solubility of the base metal in liquid solders at 250°C agrees very well with the solubility limits reported in assessed Sn-X (X = Ag, Cu, Ni, Pd) phase diagrams. The measured contact angles were generally less than 15° on Cu and Pd substrates, while they were between 25° and 30° on Ag and Ni substrates. The observed intermediate phases in Ag/solder couples were Ag₃Sn after reflow at 250°C and Ag₃Sn and ζ (Ag-Sn) after solid-state aging at 150°C. In Cu/solder and Ni/solder couples, the interfacial phases were Cu₆Sn₅ and (Cu,Ni) ₆Sn₅, respectively. In Pd/solder couples, only PdSn ₄ after 60-sec reflow, while both PdSn₄ and PdSn ₃ after 300-sec reflow, were observed.

Original language	English (US)
Pages (from-to)	1080-1091
Number of pages	12
Journal	Journal of Electronic Materials
Volume	33
Issue number	10
DOIs	https://doi.org/10.1007/s11664-004-0108-8
State	Published - Oct 2004

Keywords

Contact angle
Dissolution
Elastic properties
Interfacial reaction
Intermetallic compounds
Lead-free solder

ASJC Scopus subject areas

Electronic, Optical and Magnetic Materials
Condensed Matter Physics
Electrical and Electronic Engineering
Materials Chemistry

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10.1007/s11664-004-0108-8

Cite this

@article{8337464497994418983809531039633e,

title = "Interfacial reaction between multicomponent lead-free solders and Ag, Cu, Ni, and Pd substrates",

abstract = "The interfacial reaction between two prototype multicomponent lead-free solders, Sn-3.4Ag-1Bi-0.7Cu-4In and Sn-3.4Ag-3Bi-0.7Cu-4In (mass%), and Ag, Cu, Ni, and Pd substrates are studied at 250°C and 150°C. The microstructural characterization of the solder bumps is carried out by scanning electron microscopy (SEM) coupled with energy dispersive x-ray analysis. Ambient temperature, isotropic elastic properties (bulk, shear, and Young's moduli and Poisson's ratio) of these solders along with eutectic Sn-Ag, Sn-Bi, and Sn-Zn solders are measured. The Isotropic elastic moduli of multicomponent solders are very similar to the eutectic Sn-Ag solder. The measured solubility of the base metal in liquid solders at 250°C agrees very well with the solubility limits reported in assessed Sn-X (X = Ag, Cu, Ni, Pd) phase diagrams. The measured contact angles were generally less than 15° on Cu and Pd substrates, while they were between 25° and 30° on Ag and Ni substrates. The observed intermediate phases in Ag/solder couples were Ag3Sn after reflow at 250°C and Ag3Sn and ζ (Ag-Sn) after solid-state aging at 150°C. In Cu/solder and Ni/solder couples, the interfacial phases were Cu6Sn5 and (Cu,Ni) 6Sn5, respectively. In Pd/solder couples, only PdSn 4 after 60-sec reflow, while both PdSn4 and PdSn 3 after 300-sec reflow, were observed.",

keywords = "Contact angle, Dissolution, Elastic properties, Interfacial reaction, Intermetallic compounds, Lead-free solder",

author = "G. Ghosh",

note = "Funding Information: Financial support from the National Science Foundation (DMR-9813919). The author is grateful to Kester Solder (Skokie, IL) for preparing solder powders and for providing rosin mildly activated flux.",

year = "2004",

month = oct,

doi = "10.1007/s11664-004-0108-8",

language = "English (US)",

volume = "33",

pages = "1080--1091",

journal = "Journal of Electronic Materials",

issn = "0361-5235",

publisher = "Springer New York",

number = "10",

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TY - JOUR

T1 - Interfacial reaction between multicomponent lead-free solders and Ag, Cu, Ni, and Pd substrates

AU - Ghosh, G.

N1 - Funding Information: Financial support from the National Science Foundation (DMR-9813919). The author is grateful to Kester Solder (Skokie, IL) for preparing solder powders and for providing rosin mildly activated flux.

PY - 2004/10

Y1 - 2004/10

N2 - The interfacial reaction between two prototype multicomponent lead-free solders, Sn-3.4Ag-1Bi-0.7Cu-4In and Sn-3.4Ag-3Bi-0.7Cu-4In (mass%), and Ag, Cu, Ni, and Pd substrates are studied at 250°C and 150°C. The microstructural characterization of the solder bumps is carried out by scanning electron microscopy (SEM) coupled with energy dispersive x-ray analysis. Ambient temperature, isotropic elastic properties (bulk, shear, and Young's moduli and Poisson's ratio) of these solders along with eutectic Sn-Ag, Sn-Bi, and Sn-Zn solders are measured. The Isotropic elastic moduli of multicomponent solders are very similar to the eutectic Sn-Ag solder. The measured solubility of the base metal in liquid solders at 250°C agrees very well with the solubility limits reported in assessed Sn-X (X = Ag, Cu, Ni, Pd) phase diagrams. The measured contact angles were generally less than 15° on Cu and Pd substrates, while they were between 25° and 30° on Ag and Ni substrates. The observed intermediate phases in Ag/solder couples were Ag3Sn after reflow at 250°C and Ag3Sn and ζ (Ag-Sn) after solid-state aging at 150°C. In Cu/solder and Ni/solder couples, the interfacial phases were Cu6Sn5 and (Cu,Ni) 6Sn5, respectively. In Pd/solder couples, only PdSn 4 after 60-sec reflow, while both PdSn4 and PdSn 3 after 300-sec reflow, were observed.

AB - The interfacial reaction between two prototype multicomponent lead-free solders, Sn-3.4Ag-1Bi-0.7Cu-4In and Sn-3.4Ag-3Bi-0.7Cu-4In (mass%), and Ag, Cu, Ni, and Pd substrates are studied at 250°C and 150°C. The microstructural characterization of the solder bumps is carried out by scanning electron microscopy (SEM) coupled with energy dispersive x-ray analysis. Ambient temperature, isotropic elastic properties (bulk, shear, and Young's moduli and Poisson's ratio) of these solders along with eutectic Sn-Ag, Sn-Bi, and Sn-Zn solders are measured. The Isotropic elastic moduli of multicomponent solders are very similar to the eutectic Sn-Ag solder. The measured solubility of the base metal in liquid solders at 250°C agrees very well with the solubility limits reported in assessed Sn-X (X = Ag, Cu, Ni, Pd) phase diagrams. The measured contact angles were generally less than 15° on Cu and Pd substrates, while they were between 25° and 30° on Ag and Ni substrates. The observed intermediate phases in Ag/solder couples were Ag3Sn after reflow at 250°C and Ag3Sn and ζ (Ag-Sn) after solid-state aging at 150°C. In Cu/solder and Ni/solder couples, the interfacial phases were Cu6Sn5 and (Cu,Ni) 6Sn5, respectively. In Pd/solder couples, only PdSn 4 after 60-sec reflow, while both PdSn4 and PdSn 3 after 300-sec reflow, were observed.

KW - Contact angle

KW - Dissolution

KW - Elastic properties

KW - Interfacial reaction

KW - Intermetallic compounds

KW - Lead-free solder

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U2 - 10.1007/s11664-004-0108-8

DO - 10.1007/s11664-004-0108-8

M3 - Article

AN - SCOPUS:7044235332

SN - 0361-5235

VL - 33

SP - 1080

EP - 1091

JO - Journal of Electronic Materials

JF - Journal of Electronic Materials

IS - 10

ER -

Interfacial reaction between multicomponent lead-free solders and Ag, Cu, Ni, and Pd substrates

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Keywords

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