Interfacial reaction between multicomponent lead-free solders and Ag, Cu, Ni, and Pd substrates

G. Ghosh*

*Corresponding author for this work

Research output: Contribution to journalArticlepeer-review

33 Scopus citations

Fingerprint

Dive into the research topics of 'Interfacial reaction between multicomponent lead-free solders and Ag, Cu, Ni, and Pd substrates'. Together they form a unique fingerprint.

Engineering & Materials Science

Chemical Compounds

Physics & Astronomy