Interfacial reactions in Ni/CoSb3 couples at 450 °c

Wei An Chen; Sinn Wen Chen; Ssu Ming Tseng; Haw Wen Hsiao; Yang Yuan Chen; G. Jeffrey Snyder; Yinglu Tang

doi:10.1016/j.jallcom.2015.01.176

Interfacial reactions in Ni/CoSb₃ couples at 450 °c

Wei An Chen, Sinn Wen Chen^*, Ssu Ming Tseng, Haw Wen Hsiao, Yang Yuan Chen, G. Jeffrey Snyder, Yinglu Tang

^*Corresponding author for this work

Materials Science and Engineering

Research output: Contribution to journal › Letter › peer-review

19 Scopus citations

Abstract

CoSb₃-based alloys are promising thermoelectric materials, and nickel is commonly used as barrier layer. This study examines interfacial reactions in the Ni/Sb and Ni/CoSb₃ couples reacted at 723 K. Three reaction phases, Ni₅Sb₂, NiSb and NiSb₂, are found in the Ni/Sb couples. In the Ni/CoSb₃ couples, the reaction path is Ni/Ni₅Sb₂/(Co,Ni)Sb/CoSb₃. Nickel is the fastest diffusion species, and the growth front is at the (Co,Ni)Sb/CoSb₃ interface. Co is the second fastest diffusion species, and a Co-rich region is formed at the Ni phase. The reaction layers grow with longer reaction time. Their average growth rates in the Ni/Sb and Ni/CoSb₃ couples reacted for 20 h are 1.1 μm/h and 1.0 μm/h, respectively.

Original language	English (US)
Pages (from-to)	500-504
Number of pages	5
Journal	Journal of Alloys and Compounds
Volume	632
DOIs	https://doi.org/10.1016/j.jallcom.2015.01.176
State	Published - May 25 2015

Funding

The authors acknowledge the financial support of National Science Council of Taiwan ( NSC102-3113-P-008-001 ).

Keywords

CoSb
Interfacial reaction
Ni
Thermoelectric

ASJC Scopus subject areas

Mechanics of Materials
Mechanical Engineering
Metals and Alloys
Materials Chemistry

Access to Document

10.1016/j.jallcom.2015.01.176

Cite this

@article{a1345699c9eb477cb2d361068d9dd2e8,

title = "Interfacial reactions in Ni/CoSb3 couples at 450 °c",

abstract = "CoSb3-based alloys are promising thermoelectric materials, and nickel is commonly used as barrier layer. This study examines interfacial reactions in the Ni/Sb and Ni/CoSb3 couples reacted at 723 K. Three reaction phases, Ni5Sb2, NiSb and NiSb2, are found in the Ni/Sb couples. In the Ni/CoSb3 couples, the reaction path is Ni/Ni5Sb2/(Co,Ni)Sb/CoSb3. Nickel is the fastest diffusion species, and the growth front is at the (Co,Ni)Sb/CoSb3 interface. Co is the second fastest diffusion species, and a Co-rich region is formed at the Ni phase. The reaction layers grow with longer reaction time. Their average growth rates in the Ni/Sb and Ni/CoSb3 couples reacted for 20 h are 1.1 μm/h and 1.0 μm/h, respectively.",

keywords = "CoSb, Interfacial reaction, Ni, Thermoelectric",

author = "Chen, \{Wei An\} and Chen, \{Sinn Wen\} and Tseng, \{Ssu Ming\} and Hsiao, \{Haw Wen\} and Chen, \{Yang Yuan\} and Snyder, \{G. Jeffrey\} and Yinglu Tang",

note = "Funding Information: The authors acknowledge the financial support of National Science Council of Taiwan ( NSC102-3113-P-008-001 ). Publisher Copyright: {\textcopyright} 2015 Elsevier B.V. All rights reserved.",

year = "2015",

month = may,

day = "25",

doi = "10.1016/j.jallcom.2015.01.176",

language = "English (US)",

volume = "632",

pages = "500--504",

journal = "Journal of Alloys and Compounds",

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TY - JOUR

T1 - Interfacial reactions in Ni/CoSb3 couples at 450 °c

AU - Chen, Wei An

AU - Chen, Sinn Wen

AU - Tseng, Ssu Ming

AU - Hsiao, Haw Wen

AU - Chen, Yang Yuan

AU - Snyder, G. Jeffrey

AU - Tang, Yinglu

PY - 2015/5/25

Y1 - 2015/5/25

N2 - CoSb3-based alloys are promising thermoelectric materials, and nickel is commonly used as barrier layer. This study examines interfacial reactions in the Ni/Sb and Ni/CoSb3 couples reacted at 723 K. Three reaction phases, Ni5Sb2, NiSb and NiSb2, are found in the Ni/Sb couples. In the Ni/CoSb3 couples, the reaction path is Ni/Ni5Sb2/(Co,Ni)Sb/CoSb3. Nickel is the fastest diffusion species, and the growth front is at the (Co,Ni)Sb/CoSb3 interface. Co is the second fastest diffusion species, and a Co-rich region is formed at the Ni phase. The reaction layers grow with longer reaction time. Their average growth rates in the Ni/Sb and Ni/CoSb3 couples reacted for 20 h are 1.1 μm/h and 1.0 μm/h, respectively.

AB - CoSb3-based alloys are promising thermoelectric materials, and nickel is commonly used as barrier layer. This study examines interfacial reactions in the Ni/Sb and Ni/CoSb3 couples reacted at 723 K. Three reaction phases, Ni5Sb2, NiSb and NiSb2, are found in the Ni/Sb couples. In the Ni/CoSb3 couples, the reaction path is Ni/Ni5Sb2/(Co,Ni)Sb/CoSb3. Nickel is the fastest diffusion species, and the growth front is at the (Co,Ni)Sb/CoSb3 interface. Co is the second fastest diffusion species, and a Co-rich region is formed at the Ni phase. The reaction layers grow with longer reaction time. Their average growth rates in the Ni/Sb and Ni/CoSb3 couples reacted for 20 h are 1.1 μm/h and 1.0 μm/h, respectively.

KW - CoSb

KW - Interfacial reaction

KW - Ni

KW - Thermoelectric

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U2 - 10.1016/j.jallcom.2015.01.176

DO - 10.1016/j.jallcom.2015.01.176

M3 - Letter

AN - SCOPUS:84922669757

SN - 0925-8388

VL - 632

SP - 500

EP - 504

JO - Journal of Alloys and Compounds

JF - Journal of Alloys and Compounds

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