Interfacial shear stress, peeling stress, and die cracking stress in trilayer electronic assemblies

K. Wang*, Y. Huang, A. Chandra, K. X. Hu

*Corresponding author for this work

Research output: Contribution to journalArticle

7 Scopus citations

Abstract

Interfacial shear stress, peeling stress, and die cracking stress due to thermal and elastic mismatch in layered electronic assemblies are one of the major causes of the mechanical failure of electronic packages. A simple but rather accurate method is developed to estimate these thermal stresses for packages with different layer lengths. For layered electronics with thin adhesives, analytical expressions are obtained for interfacial shear stress and peeling stress, and they agree well with the finite element analysis, especially when the moduli of adhesive layers are significantly lower than the moduli of the other layers. An analytic expression of die cracking stress is also obtained for multilayer electronic assemblies.

Original languageEnglish (US)
Pages (from-to)56-64
Number of pages9
JournalThermomechanical Phenomena in Electronic Systems -Proceedings of the Intersociety Conference
Volume2
StatePublished - Jan 1 2000

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Condensed Matter Physics
  • Electrical and Electronic Engineering
  • Materials Chemistry

Fingerprint Dive into the research topics of 'Interfacial shear stress, peeling stress, and die cracking stress in trilayer electronic assemblies'. Together they form a unique fingerprint.

  • Cite this