Abstract
Interfacial shear stress, peeling stress, and die cracking stress due to thermal and elastic mismatch in layered electronic assemblies are one of the major causes of the mechanical failure of electronic packages. A simple but rather accurate method is developed to estimate these thermal stresses for packages with different layer lengths. For layered electronics with thin adhesives, analytical expressions are obtained for interfacial shear stress and peeling stress, and they agree well with the finite element analysis, especially when the moduli of adhesive layers are significantly lower than the moduli of the other layers. An analytic expression of die cracking stress is also obtained for multilayer electronic assemblies.
| Original language | English (US) |
|---|---|
| Pages (from-to) | 56-64 |
| Number of pages | 9 |
| Journal | Thermomechanical Phenomena in Electronic Systems -Proceedings of the Intersociety Conference |
| Volume | 2 |
| State | Published - Jan 1 2000 |
ASJC Scopus subject areas
- Electronic, Optical and Magnetic Materials
- Condensed Matter Physics
- Electrical and Electronic Engineering
- Materials Chemistry