Interfacial thermal conductance of transfer-printed metal films

Dong Wook Oh; Seok Kim; John A. Rogers; David G. Cahill; Sanjiv Sinha

doi:10.1002/adma.201102994

Interfacial thermal conductance of transfer-printed metal films

Dong Wook Oh, Seok Kim, John A. Rogers, David G. Cahill^*, Sanjiv Sinha

^*Corresponding author for this work

Materials Science and Engineering

Research output: Contribution to journal › Article › peer-review

67 Scopus citations

Abstract

The thermal conductance of transfer-printed interfaces is found to be surprisingly high, only a factor of 2-10 smaller than the thermal conductance of interfaces formed by physical vapor deposition. These results have practical importance for the thermal management of electronic devices assembled by transfer-printing and provide fundamental insights on the nature of solid-solid contacts between elastically stiff materials.

Original language	English (US)
Pages (from-to)	5028-5033
Number of pages	6
Journal	Advanced Materials
Volume	23
Issue number	43
DOIs	https://doi.org/10.1002/adma.201102994
State	Published - Nov 16 2011

Keywords

characterization tools
flexible electronics
microcontact printing
structure-property relationships
thin films

ASJC Scopus subject areas

Mechanics of Materials
Mechanical Engineering
General Materials Science

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10.1002/adma.201102994

Cite this

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title = "Interfacial thermal conductance of transfer-printed metal films",

abstract = "The thermal conductance of transfer-printed interfaces is found to be surprisingly high, only a factor of 2-10 smaller than the thermal conductance of interfaces formed by physical vapor deposition. These results have practical importance for the thermal management of electronic devices assembled by transfer-printing and provide fundamental insights on the nature of solid-solid contacts between elastically stiff materials.",

keywords = "characterization tools, flexible electronics, microcontact printing, structure-property relationships, thin films",

author = "Oh, {Dong Wook} and Seok Kim and Rogers, {John A.} and Cahill, {David G.} and Sanjiv Sinha",

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AU - Oh, Dong Wook

AU - Kim, Seok

AU - Rogers, John A.

AU - Cahill, David G.

AU - Sinha, Sanjiv

PY - 2011/11/16

Y1 - 2011/11/16

N2 - The thermal conductance of transfer-printed interfaces is found to be surprisingly high, only a factor of 2-10 smaller than the thermal conductance of interfaces formed by physical vapor deposition. These results have practical importance for the thermal management of electronic devices assembled by transfer-printing and provide fundamental insights on the nature of solid-solid contacts between elastically stiff materials.

AB - The thermal conductance of transfer-printed interfaces is found to be surprisingly high, only a factor of 2-10 smaller than the thermal conductance of interfaces formed by physical vapor deposition. These results have practical importance for the thermal management of electronic devices assembled by transfer-printing and provide fundamental insights on the nature of solid-solid contacts between elastically stiff materials.

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KW - flexible electronics

KW - microcontact printing

KW - structure-property relationships

KW - thin films

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Interfacial thermal conductance of transfer-printed metal films

Abstract

Keywords

ASJC Scopus subject areas

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