Interfacial thermal conductance of transfer-printed metal films

Dong Wook Oh, Seok Kim, John A. Rogers, David G. Cahill*, Sanjiv Sinha

*Corresponding author for this work

Research output: Contribution to journalArticlepeer-review

51 Scopus citations

Abstract

The thermal conductance of transfer-printed interfaces is found to be surprisingly high, only a factor of 2-10 smaller than the thermal conductance of interfaces formed by physical vapor deposition. These results have practical importance for the thermal management of electronic devices assembled by transfer-printing and provide fundamental insights on the nature of solid-solid contacts between elastically stiff materials.

Original languageEnglish (US)
Pages (from-to)5028-5033
Number of pages6
JournalAdvanced Materials
Volume23
Issue number43
DOIs
StatePublished - Nov 16 2011

Keywords

  • characterization tools
  • flexible electronics
  • microcontact printing
  • structure-property relationships
  • thin films

ASJC Scopus subject areas

  • Materials Science(all)
  • Mechanics of Materials
  • Mechanical Engineering

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