Intersonic crack growth in bimaterial interfaces: An investigation of crack face contact

Y. Huang*, W. Wang, C. Liu, A. J. Rosakis

*Corresponding author for this work

Research output: Contribution to journalArticle

44 Scopus citations

Abstract

Steady-state intersonic interfacial crack growth accounting for crack face contact is analyzed. The results clearly predict the essential features of experimental observations based on two different but complementary optical techniques and high speed photography. The solution features a large scale contact zone and two distinct traveling shock waves, one emanating from the crack tip and the other from the end of the contact zone. In addition, the solution predicts a non-zero energy dissipation rate due to crack face contact.

Original languageEnglish (US)
Pages (from-to)2233-2259
Number of pages27
JournalJournal of the Mechanics and Physics of Solids
Volume46
Issue number11
DOIs
StatePublished - Oct 23 1998

Keywords

  • Bimaterial interface
  • Crack face contact
  • Intersonic crack growth

ASJC Scopus subject areas

  • Condensed Matter Physics
  • Mechanics of Materials
  • Mechanical Engineering

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