Intersonic debonding: Interfacial and Nanoscale Fracture

Yonggang Huang

Research output: Chapter in Book/Report/Conference proceeding › Chapter

Original languageEnglish
Title of host publicationComprehensive Structural Integrity Handbook
Subtitle of host publicationInterfacial and Nanoscale Fracture
PublisherElsevier Science
Pages137-179
Volume8
StatePublished - 2003

Cite this

Huang, Y. (2003). Intersonic debonding: Interfacial and Nanoscale Fracture. In Comprehensive Structural Integrity Handbook: Interfacial and Nanoscale Fracture (Vol. 8, pp. 137-179). Elsevier Science.
Huang, Yonggang. / Intersonic debonding : Interfacial and Nanoscale Fracture. Comprehensive Structural Integrity Handbook: Interfacial and Nanoscale Fracture. Vol. 8 Elsevier Science, 2003. pp. 137-179
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author = "Yonggang Huang",
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booktitle = "Comprehensive Structural Integrity Handbook",
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Huang, Y 2003, Intersonic debonding: Interfacial and Nanoscale Fracture. in Comprehensive Structural Integrity Handbook: Interfacial and Nanoscale Fracture. vol. 8, Elsevier Science, pp. 137-179.

Intersonic debonding : Interfacial and Nanoscale Fracture. / Huang, Yonggang.

Comprehensive Structural Integrity Handbook: Interfacial and Nanoscale Fracture. Vol. 8 Elsevier Science, 2003. p. 137-179.

Research output: Chapter in Book/Report/Conference proceeding › Chapter

TY - CHAP

T1 - Intersonic debonding

T2 - Interfacial and Nanoscale Fracture

AU - Huang, Yonggang

PY - 2003

Y1 - 2003

M3 - Chapter

VL - 8

SP - 137

EP - 179

BT - Comprehensive Structural Integrity Handbook

PB - Elsevier Science

ER -

Huang Y. Intersonic debonding: Interfacial and Nanoscale Fracture. In Comprehensive Structural Integrity Handbook: Interfacial and Nanoscale Fracture. Vol. 8. Elsevier Science. 2003. p. 137-179