Interstitial carbon in copper: Electronic and mechanical properties

D. E. Ellis, K. C. Mundim, D. Fuks, S. Dorfman, A. Berner*

*Corresponding author for this work

Research output: Contribution to journalArticle

32 Scopus citations

Abstract

The effects of interstitial carbon on the electronic and mechanical properties of copper are studied theoretically. Semiempirical methodology, atomistic simulations and first-principles density-functional embedded-cluster schemes are combined to extract some understanding of the diffusion process and related degradation of Cu-C composite materials under extremes of temperature and stress. High-resolution scanning electron microscopy results are presented, which demonstrate the existence of a solid solution zone at the Cu-C interface.

Original languageEnglish (US)
Pages (from-to)1615-1630
Number of pages16
JournalPhilosophical Magazine B: Physics of Condensed Matter; Statistical Mechanics, Electronic, Optical and Magnetic Properties
Volume79
Issue number10
DOIs
StatePublished - Oct 1999

ASJC Scopus subject areas

  • Chemical Engineering(all)
  • Physics and Astronomy(all)

Fingerprint Dive into the research topics of 'Interstitial carbon in copper: Electronic and mechanical properties'. Together they form a unique fingerprint.

  • Cite this