Keyphrases
Magnetron Sputtering Deposition
100%
Carbon Ratio
100%
Carbon Nitride Film
100%
Amorphous Carbon Nitride
100%
Radio Frequency Plasma
100%
Film Hardness
66%
Chemical Bonding
33%
Processing Parameters
33%
Chemical Composition
33%
Reactive Gas
33%
Carbon Film
33%
Substrate Bias Voltage
33%
Magnetron Sputtering System
33%
Auger Electron Spectroscopy
33%
Deposited Film
33%
Argon
33%
Gas Partial Pressure
33%
Total Pressure
33%
Deposition Conditions
33%
High-purity Graphite
33%
Ionization Degree
33%
Radio Frequency Power
33%
Inductively Coupled
33%
Sputtering Gas
33%
Pulsed Substrate Bias
33%
Engineering
Nitride
100%
Amorphous Carbon
100%
Thin Films
100%
Radio Frequency
100%
Magnetron
100%
Carbon Ratio
75%
Deposited Film
25%
Substrate Bias
25%
Bias Voltage
25%
Optimum Condition
25%
Processing Variable
25%
Deposition Condition
25%
Partial Pressure
25%
Substrate Table
25%
Phase Composition
25%
Material Science
Amorphous Carbon
100%
Carbon Nitride
100%
Sputter Deposition
100%
Film
100%
Thin Films
100%
Magnetron Sputtering
25%
Chemical Bonding
25%
Auger Electron Spectroscopy
25%
Phase Composition
25%