IOTA: Towards an integrated on-chip thermocouple array

Jieyi Long*, Andrea Grace Klock, Chuanle Zhou, Seda Ogrenci Memik, Matthew Grayson

*Corresponding author for this work

Research output: Chapter in Book/Report/Conference proceedingConference contribution

7 Scopus citations

Abstract

We present the design concept of a bimetallic thermocouple array-based temperature sensor to monitor thermal behavior of integrated circuits. Our proposed design is able to provide fine-grain thermal characterization. Such a sensor array that is capable of monitoring a large area accurately at a fine granularity is essential to perform reliable and effective dynamic thermal management for high performance chips. Since our proposed thermocouple array-based sensor uses only metals, the resulting sensor design occupies minimal area on the silicon layer. Furthermore, we show that such a metal-based design is advantageous in mitigating process variations. The working principle of the proposed thermocouple array is demonstrated with a bimetallic macroscopic prototype. Our thermocouple prototype tracks the temperature variation from 20 °C to 160 °C to within less than 1 °C. Furthermore, our analysis indicates that the sensor array is robust against process variations to a thermal accuracy of less than 1 °C.

Original languageEnglish (US)
Title of host publication16th International Workshop on Thermal Investigations of ICs and Systems, THERMINIC 2010
Pages7-12
Number of pages6
StatePublished - Dec 28 2010
Event16th International Workshop on Thermal Investigations of ICs and Systems, THERMINIC 2010 - Barcelona, Spain
Duration: Oct 6 2010Oct 8 2010

Publication series

Name16th International Workshop on Thermal Investigations of ICs and Systems, THERMINIC 2010

Other

Other16th International Workshop on Thermal Investigations of ICs and Systems, THERMINIC 2010
Country/TerritorySpain
CityBarcelona
Period10/6/1010/8/10

ASJC Scopus subject areas

  • Hardware and Architecture
  • Electrical and Electronic Engineering

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