IOTA: Towards an integrated on-chip thermocouple array

Jieyi Long*, Andrea Grace Klock, Chuanle Zhou, Seda Ogrenci Memik, Matthew Grayson

*Corresponding author for this work

Research output: Chapter in Book/Report/Conference proceedingConference contribution

7 Scopus citations

Abstract

We present the design concept of a bimetallic thermocouple array-based temperature sensor to monitor thermal behavior of integrated circuits. Our proposed design is able to provide fine-grain thermal characterization. Such a sensor array that is capable of monitoring a large area accurately at a fine granularity is essential to perform reliable and effective dynamic thermal management for high performance chips. Since our proposed thermocouple array-based sensor uses only metals, the resulting sensor design occupies minimal area on the silicon layer. Furthermore, we show that such a metal-based design is advantageous in mitigating process variations. The working principle of the proposed thermocouple array is demonstrated with a bimetallic macroscopic prototype. Our thermocouple prototype tracks the temperature variation from 20 °C to 160 °C to within less than 1 °C. Furthermore, our analysis indicates that the sensor array is robust against process variations to a thermal accuracy of less than 1 °C.

Original languageEnglish (US)
Title of host publication16th International Workshop on Thermal Investigations of ICs and Systems, THERMINIC 2010
Pages7-12
Number of pages6
StatePublished - Dec 28 2010
Event16th International Workshop on Thermal Investigations of ICs and Systems, THERMINIC 2010 - Barcelona, Spain
Duration: Oct 6 2010Oct 8 2010

Publication series

Name16th International Workshop on Thermal Investigations of ICs and Systems, THERMINIC 2010

Other

Other16th International Workshop on Thermal Investigations of ICs and Systems, THERMINIC 2010
CountrySpain
CityBarcelona
Period10/6/1010/8/10

ASJC Scopus subject areas

  • Hardware and Architecture
  • Electrical and Electronic Engineering

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