Isothermal solidification of Cu/Sn diffusion couples to form thin-solder joints

J. S. Kang, R. A. Gagliano*, G. Ghosh, M. E. Fine

*Corresponding author for this work

Research output: Contribution to journalArticlepeer-review

41 Scopus citations

Abstract

Isothermal solidification of conventional Cu/Sn diffusional couples was performed to form thin (30 μm) joints consisting of Cu-Sn intermetallics. During initial stages of isothermal solidification, both Cu6Sn5 and Cu3Sn phases grow, even though the former is the dominant. After consumption of all available Sn, the Cu3Sn phase grows reactively at the expense of Cu and Cu6Sn5. Finally, we obtain solder joints that consist of only Cu3Sn. Indentation fracture-toughness measurements show that Cu3Sn is superior to Cu6Sn5. Furthermore, indentations of Cu3Sn exhibit the presence of shear bands, which are not observed in Cu6Sn5, implying that the former is more ductile than the latter. Ductile intermetallic-based joints formed by isothermal solidification are promising candidates to form thin (as thin as 5-10 μm or less) solder joints, as they are thermally and thermodynamically stable compared to conventional solder joints. Excess copper in the interconnect provides ductility to the interconnect.

Original languageEnglish (US)
Pages (from-to)1238-1243
Number of pages6
JournalJournal of Electronic Materials
Volume31
Issue number11
DOIs
StatePublished - Nov 2002

Keywords

  • Cu/Sn
  • Diffusional couples
  • Solder joints

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Condensed Matter Physics
  • Electrical and Electronic Engineering
  • Materials Chemistry

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