Kinetically controlled, adhesiveless transfer printing using microstructured stamps

Tae Ho Kim*, Andrew Carlson, Jong Hyun Ahn, Sang Min Won, Shuodao Wang, Yonggang Huang, John A. Rogers

*Corresponding author for this work

Research output: Contribution to journalArticle

60 Citations (Scopus)

Abstract

This letter describes the physics and application of an approach to transfer printing that uses stamps with microstructures of relief embossed into their surfaces. Experimental measurement of velocity-dependent adhesive strength as a function of relief geometry reveals key scaling properties and provides a means for comparison to theoretical expectation. Formation of transistor devices that use nanoribbons of silicon transfer printed directly onto glass substrates without adhesive layers demonstrates the use of this type of approach for a high-performance (mobilities > 325 cm 2 /V s and on/off ratios > 10 5 ) single crystal silicon on glass technology.

Original languageEnglish (US)
Article number113502
JournalApplied Physics Letters
Volume94
Issue number11
DOIs
StatePublished - Mar 31 2009

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printing
adhesives
glass
silicon
transistors
scaling
microstructure
physics
single crystals
geometry

ASJC Scopus subject areas

  • Physics and Astronomy (miscellaneous)

Cite this

Kim, Tae Ho ; Carlson, Andrew ; Ahn, Jong Hyun ; Won, Sang Min ; Wang, Shuodao ; Huang, Yonggang ; Rogers, John A. / Kinetically controlled, adhesiveless transfer printing using microstructured stamps. In: Applied Physics Letters. 2009 ; Vol. 94, No. 11.
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Kinetically controlled, adhesiveless transfer printing using microstructured stamps. / Kim, Tae Ho; Carlson, Andrew; Ahn, Jong Hyun; Won, Sang Min; Wang, Shuodao; Huang, Yonggang; Rogers, John A.

In: Applied Physics Letters, Vol. 94, No. 11, 113502, 31.03.2009.

Research output: Contribution to journalArticle

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