Kinetically controlled, adhesiveless transfer printing using microstructured stamps

Tae Ho Kim*, Andrew Carlson, Jong Hyun Ahn, Sang Min Won, Shuodao Wang, Yonggang Huang, John A. Rogers

*Corresponding author for this work

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Abstract

This letter describes the physics and application of an approach to transfer printing that uses stamps with microstructures of relief embossed into their surfaces. Experimental measurement of velocity-dependent adhesive strength as a function of relief geometry reveals key scaling properties and provides a means for comparison to theoretical expectation. Formation of transistor devices that use nanoribbons of silicon transfer printed directly onto glass substrates without adhesive layers demonstrates the use of this type of approach for a high-performance (mobilities > 325 cm 2 /V s and on/off ratios > 10 5 ) single crystal silicon on glass technology.

Original languageEnglish (US)
Article number113502
JournalApplied Physics Letters
Volume94
Issue number11
DOIs
StatePublished - Mar 31 2009

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ASJC Scopus subject areas

  • Physics and Astronomy (miscellaneous)

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