Keyphrases
Soldering
100%
Interfacial Reaction
100%
Ni-Pd
100%
Cu-Ni
100%
Metallization
100%
SnPb Solder
100%
Ni3S4
71%
Substrate Interface
42%
PdSn4
42%
Solid State
28%
Intermetallics
28%
Liquid State
28%
Diffusion Path
28%
Growth Kinetics
28%
Pb-Sn
28%
Isothermal Section
28%
Interfacial Microstructure
28%
Scanning Electron Microscope
14%
Temperature Effect
14%
Energy Dispersive X-ray Analysis
14%
Selective Etching
14%
Cu Substrate
14%
Path-based
14%
Apparent Activation Energy
14%
Pre-exponential Factor
14%
Arrhenius-type
14%
Time Exponent
14%
Intermetallic Layer
14%
Isothermal Reaction
14%
Electroplated Ni
14%
Solid-state Aging
14%
Liquid State Reaction
14%
Engineering
Substrate Interface
100%
Metallizations
100%
Eutectics
100%
Intermetallics
100%
Growth Kinetics
66%
Diffusion Path
66%
Isothermal Section
66%
Isothermal
33%
Mols
33%
Arrhenius
33%
Apparent Activation Energy
33%
Pre-Exponential Factor
33%
State Reaction
33%
Selective Etching
33%
Initial Thickness
33%
Energy Engineering
33%
Rod
33%
Scanning Electron Microscope
33%
Flat Surface
33%
Material Science
Liquid
100%
Intermetallics
100%
Scanning Electron Microscopy
33%
Activation Energy
33%