Large area, rubber stamped plastic circuits for electronic paper

John A. Rogers*, Kirk Baldwin, Zhenan Bao, Ananth Dodabalapur, V. R. Raju, Jay Ewing, Karl Amundson

*Corresponding author for this work

Research output: Contribution to journalConference articlepeer-review

5 Scopus citations


This paper illustrates the use of a high resolution form of rubber stamping, known as microcontact printing (μCP), for patterning plastic active matrix drive circuitry designed for electronic paper. The high resolution (∼1 μm) of the printed elements, the large area coverage (∼1 sq. ft.) and the good electrical performance of these systems suggest that the methods, materials and processing sequences may be attractive for realistic applications of plastic electronics.

Original languageEnglish (US)
Pages (from-to)JJ7.1.1-JJ7.1.8
JournalMaterials Research Society Symposium - Proceedings
StatePublished - 2001
EventOrganic Electronic and Photonic Materials and Devices - Boston, MA, United States
Duration: Nov 27 2000Nov 30 2000

ASJC Scopus subject areas

  • Materials Science(all)
  • Condensed Matter Physics
  • Mechanics of Materials
  • Mechanical Engineering


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