Large area, rubber stamped plastic circuits for electronic paper

John A. Rogers; Kirk Baldwin; Zhenan Bao; Ananth Dodabalapur; V. R. Raju; Jay Ewing; Karl Amundson

Large area, rubber stamped plastic circuits for electronic paper

John A. Rogers, Kirk Baldwin, Zhenan Bao, Ananth Dodabalapur, V. R. Raju, Jay Ewing, Karl Amundson

Materials Science and Engineering

Research output: Contribution to journal › Article › peer-review

1 Scopus citations

Abstract

This paper illustrates the use of a high resolution form of rubber stamping, known as microcontact printing (μCP), for patterning plastic active matrix drive circuitry designed for electronic paper. The high resolution (∼1 μm) of the printed elements, the large area coverage (∼1 sq. ft.) and the good electrical performance of these systems suggest that the methods, materials and processing sequences may be attractive for realistic applications of plastic electronics.

Original language	English (US)
Pages (from-to)	JJ7.1.1-JJ7.1.8
Journal	Materials Research Society Symposium - Proceedings
Volume	660
State	Published - Jan 1 2001

ASJC Scopus subject areas

Materials Science(all)
Condensed Matter Physics
Mechanics of Materials
Mechanical Engineering

Cite this

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abstract = "This paper illustrates the use of a high resolution form of rubber stamping, known as microcontact printing (μCP), for patterning plastic active matrix drive circuitry designed for electronic paper. The high resolution (∼1 μm) of the printed elements, the large area coverage (∼1 sq. ft.) and the good electrical performance of these systems suggest that the methods, materials and processing sequences may be attractive for realistic applications of plastic electronics.",

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AU - Baldwin, Kirk

AU - Bao, Zhenan

AU - Dodabalapur, Ananth

AU - Raju, V. R.

AU - Ewing, Jay

AU - Amundson, Karl

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Large area, rubber stamped plastic circuits for electronic paper

Abstract

ASJC Scopus subject areas

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