TY - JOUR
T1 - Large area, rubber stamped plastic sheets of active matrix backplane circuitry for electronic paper
AU - Rogers, J. A.
AU - Baldwin, K.
AU - Bao, Z.
AU - Crone, B.
AU - Dodabalapur, A.
AU - Lin, Y. Y.
AU - Raju, V. R.
PY - 2000/12/1
Y1 - 2000/12/1
N2 - A high resolution technique for rubber stamping, known as microcontact printing (μCP), offers many features that are well suited for fabricating low cost organic electronic systems. This paper illustrates the use of μCP for patterning plastic active matrix drive circuitry designed for electronic paper. The high resolution (∼1 micron) of the printed elements, the large area coverage (∼1 sq. ft.) and the good electrical performance of these systems suggest that the methods, materials and processings sequences may be attractive for new types of plastic electronic devices for consumer applications.
AB - A high resolution technique for rubber stamping, known as microcontact printing (μCP), offers many features that are well suited for fabricating low cost organic electronic systems. This paper illustrates the use of μCP for patterning plastic active matrix drive circuitry designed for electronic paper. The high resolution (∼1 micron) of the printed elements, the large area coverage (∼1 sq. ft.) and the good electrical performance of these systems suggest that the methods, materials and processings sequences may be attractive for new types of plastic electronic devices for consumer applications.
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M3 - Conference article
AN - SCOPUS:0034460977
SN - 1048-0854
SP - 507
EP - 513
JO - Advanced Metallization Conference (AMC)
JF - Advanced Metallization Conference (AMC)
T2 - Advanced Metallization Conference 2000
Y2 - 2 October 2000 through 4 October 2000
ER -