Large-area, selective transfer of microstructured silicon: A printing-based approach to high-performance thin-film transistors supported on flexible substrates

Keon Jae Lee*, Michael J. Motala, Matthew A. Meitl, William R. Childs, Etienne Menard, Anne K. Shim, John A. Rogers, Ralph G. Nuzzo

*Corresponding author for this work

Research output: Contribution to journalArticlepeer-review

125 Scopus citations

Abstract

A printing-based approach to high-performance thin-film transistors supported on flexible substrates was studied by a large-area, selective transfer of microstructured silicon. In Method I, a peanut-shaped photoresist pattern was developed on top of a SOI substrate using standard photolithography techniques. Method II uses a masterless soft-lithography technique to chemically bond the μs-Si to a PDMS-coated substrate. After heating, the PDMS was peeled from the SOI, resulting in patterned transfer of μs-Si to the UVO-modified regions of the PDMS.

Original languageEnglish (US)
Pages (from-to)2332-2336
Number of pages5
JournalAdvanced Materials
Volume17
Issue number19
DOIs
StatePublished - Oct 4 2005

ASJC Scopus subject areas

  • Materials Science(all)
  • Mechanics of Materials
  • Mechanical Engineering

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