Large-area, selective transfer of microstructured silicon: A printing-based approach to high-performance thin-film transistors supported on flexible substrates

Keon Jae Lee; Michael J. Motala; Matthew A. Meitl; William R. Childs; Etienne Menard; Anne K. Shim; John A. Rogers; Ralph G. Nuzzo

doi:10.1002/adma.200500578

Large-area, selective transfer of microstructured silicon: A printing-based approach to high-performance thin-film transistors supported on flexible substrates

Keon Jae Lee^*, Michael J. Motala, Matthew A. Meitl, William R. Childs, Etienne Menard, Anne K. Shim, John A. Rogers, Ralph G. Nuzzo

^*Corresponding author for this work

Materials Science and Engineering

Research output: Contribution to journal › Article › peer-review

136 Scopus citations

Abstract

A printing-based approach to high-performance thin-film transistors supported on flexible substrates was studied by a large-area, selective transfer of microstructured silicon. In Method I, a peanut-shaped photoresist pattern was developed on top of a SOI substrate using standard photolithography techniques. Method II uses a masterless soft-lithography technique to chemically bond the μs-Si to a PDMS-coated substrate. After heating, the PDMS was peeled from the SOI, resulting in patterned transfer of μs-Si to the UVO-modified regions of the PDMS.

Original language	English (US)
Pages (from-to)	2332-2336
Number of pages	5
Journal	Advanced Materials
Volume	17
Issue number	19
DOIs	https://doi.org/10.1002/adma.200500578
State	Published - Oct 4 2005

ASJC Scopus subject areas

General Materials Science
Mechanics of Materials
Mechanical Engineering

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title = "Large-area, selective transfer of microstructured silicon: A printing-based approach to high-performance thin-film transistors supported on flexible substrates",

abstract = "A printing-based approach to high-performance thin-film transistors supported on flexible substrates was studied by a large-area, selective transfer of microstructured silicon. In Method I, a peanut-shaped photoresist pattern was developed on top of a SOI substrate using standard photolithography techniques. Method II uses a masterless soft-lithography technique to chemically bond the μs-Si to a PDMS-coated substrate. After heating, the PDMS was peeled from the SOI, resulting in patterned transfer of μs-Si to the UVO-modified regions of the PDMS.",

author = "Lee, {Keon Jae} and Motala, {Michael J.} and Meitl, {Matthew A.} and Childs, {William R.} and Etienne Menard and Shim, {Anne K.} and Rogers, {John A.} and Nuzzo, {Ralph G.}",

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T2 - A printing-based approach to high-performance thin-film transistors supported on flexible substrates

AU - Lee, Keon Jae

AU - Motala, Michael J.

AU - Meitl, Matthew A.

AU - Childs, William R.

AU - Menard, Etienne

AU - Shim, Anne K.

AU - Rogers, John A.

AU - Nuzzo, Ralph G.

PY - 2005/10/4

Y1 - 2005/10/4

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AB - A printing-based approach to high-performance thin-film transistors supported on flexible substrates was studied by a large-area, selective transfer of microstructured silicon. In Method I, a peanut-shaped photoresist pattern was developed on top of a SOI substrate using standard photolithography techniques. Method II uses a masterless soft-lithography technique to chemically bond the μs-Si to a PDMS-coated substrate. After heating, the PDMS was peeled from the SOI, resulting in patterned transfer of μs-Si to the UVO-modified regions of the PDMS.

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Large-area, selective transfer of microstructured silicon: A printing-based approach to high-performance thin-film transistors supported on flexible substrates

Abstract

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