LegoSENSE: An Open and Modular Sensing Platform for Rapidly-Deployable IoT Applications

Minghui Zhao, Stephen Xia, Jingping Nie, Kaiyuan Hou, Avik Dhupar, Xiaofan Jiang

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

Domain-specific sensor deployments are critical to enabling various IoT applications. Existing solutions for quickly deploying sensing systems require significant amount of work and time, even for experienced engineers. We propose LegoSENSE, a low-cost open-source and modular platform, built on top of the widely popular Raspberry Pi single-board computer, that makes it simple for anyone to rapidly set up and deploy a customized sensing solution for application specific IoT deployments. In addition, the ĝplug and play' and ĝmix and match' functionality of LegoSENSE makes the sensor modules reusable, and allows them to be mixed and matched to serve a variety of needs. We show, through a series of user studies, that LegoSENSE enables users without engineering background to deploy a wide range of applications up to 9 × faster than experienced engineers without the use of LegoSENSE. We open-source the hardware and software designs to foster an ever-evolving community, enabling IoT applications for enthusiasts, students, scientists, and researchers across various application domains with or without prior experiences with embedded platforms or coding.

Original languageEnglish (US)
Title of host publicationProceedings - 8th ACM/IEEE Conference on Internet of Things Design and Implementation, IoTDI 2023
PublisherAssociation for Computing Machinery
Pages367-380
Number of pages14
ISBN (Electronic)9798400700378
DOIs
StatePublished - May 9 2023
Event8th ACM/IEEE Conference on Internet of Things Design and Implementation, IoTDI 2023 - San Antonio, United States
Duration: May 9 2023May 12 2023

Publication series

NameACM International Conference Proceeding Series

Conference

Conference8th ACM/IEEE Conference on Internet of Things Design and Implementation, IoTDI 2023
Country/TerritoryUnited States
CitySan Antonio
Period5/9/235/12/23

Funding

This research was partially supported by the National Science Foundation under Grant Numbers CNS-1704899, CNS-1815274, CNS-1943396, CNS-1837022, and CMMI-2218809, as well as COG-NISENSE, one of seven centers in JUMP 2.0, a Semiconductor Research Corporation (SRC) program sponsored by DARPA. The views and conclusions contained here are those of the authors and should not be interpreted as necessarily representing the official policies or endorsements, either expressed or implied, of Columbia University, NSF, SRC, DARPA, or the U.S. Government or any of its agencies.

Keywords

  • IoT
  • platform
  • plug and play system
  • rapid deployment
  • sensor

ASJC Scopus subject areas

  • Human-Computer Interaction
  • Computer Networks and Communications
  • Computer Vision and Pattern Recognition
  • Software

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